Latest PCB (Printed Circuit Board) Core Competencies | Cicor Group

As electronic systems continue to evolve toward higher frequencies, greater miniaturization, and more demanding operating environments, substrate technologies are being pushed to deliver improved precision, connectivity, and thermal performance. Cicor Group’s thin-film substrate technology rep... Read More

Cicor Group has long been at the forefront of advanced electronic manufacturing, with a strong focus on high-reliability solutions for demanding industries. Among its core capabilities, the company’s thick-film substrate technology stands out as a mature yet continuously evolving platform desi... Read More

The 3D-MID technology from Cicor Technologies is an innovative manufacturing technology that combines mechanical and electronic functions into a single three-dimensional component. This integration eliminates the need for separate circuit boards, connectors, and wiring. By integrating these elements... Read More

Cicor has introduced its groundbreaking DenciTec® PCBs, pushing the boundaries of high-density circuit manufacturing. Leveraging advanced technologies and innovative base materials, Cicor ensures unparalleled quality and design freedom. This breakthrough promises significant miniaturization, gre... Read More

Cicor Technologies is offering its latest innovation in flexible printed circuit boards (FPC), heralding a new era of 3D miniaturization. With an emphasis on ultra-high density interconnect (HDI) and remarkably low bending radii, these FPCs are poised to redefine the landscape of device integration.... Read More

Cicor Group, a leading provider of electronic solutions can develop rigid-flexible PCBs. These cutting-edge boards combine the benefits of both rigid and flexible PCBs, revolutionizing electronic design and manufacturing processes. Cicor offers a diverse range of rigid-flex PCB constructions, utiliz... Read More