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Henkel Corporation – Electronics has expanded its portfolio of advanced circuit board protection solutions with the introduction of a peelable solder mask based on its proven Technomelt® material technology. The new formulation, Technomelt® AS 8998, is designed to simplify and modernize masking processes for printed circuit assemblies undergoing coating or chemical deposition.
Henkel Corporation Introduces Peelable Solder Mask Based on its Technomelt® Material
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Technomelt® materials have long been recognized as an industry benchmark for high-performance, low-pressure molding and encapsulation applications. With Technomelt® AS 8998, Henkel extends the benefits of this technology beyond encapsulation, offering a streamlined and cost-effective alternative to traditional masking methods such as manual taping, UV masks, or liquid masking compounds.
Developed specifically to protect “keep-out zones” on PCBs, Technomelt® AS 8998 enables fast, precise, and automated dispensing. The material is slump-resistant, allowing accurate deposition in very small and highly miniaturized areas without migration. This precision ensures that only the intended components or board regions remain free of protective coatings, improving both process control and final product quality.
Once dispensed, the hot-melt material exhibits excellent green strength and solidifies upon cooling, eliminating the need for thermal or UV curing. After the coating process is complete, the mask peels off quickly and cleanly, leaving sharp edges and no residue. This peelability provides a clear advantage over conventional masking solutions that are often difficult to remove and can leave contamination behind.
Technomelt® AS 8998 is silicone-free, halogen-free, and RoHS compliant, making it suitable for a wide range of electronics manufacturing environments. It adheres well to multiple substrate surfaces during coating processes and is compatible with common automated dispensing systems, supporting high-throughput production lines.
Henkel highlights that the economic benefits of the new peelable solder mask are already being realized in production. Early adopters, including large EMS providers, have demonstrated significant reductions in overall masking costs. When accounting for process efficiency, material usage, and equipment savings, some manufacturers have achieved cost reductions of more than 40 percent compared with traditional tape-based and UV-cured masking approaches.
The current formulation of Technomelt® AS 8998 supports thermal processes up to 100°C, aligning with most common coating applications. Henkel is also developing future variants with higher temperature resistance to further broaden the range of compatible processes.
With the introduction of this peelable solder mask solution, Henkel Corporation – Electronics continues to address the growing demand for automation-ready, precise, and economical materials tailored to increasingly miniaturized and high-volume electronics manufacturing.
Click here to learn more about Peelable Soldder Mask from Henkel Corporation.
