Indium Corporation to Showcase AuLTRA Die-Attach Solutions at IMS 2026

https://cdn.pcbdirectory.com/news/Untitled_design_49__639159699199046120.webp712370

Indium Corporation will highlight its gold-based precision die-attach preforms for RF and microwave applications at the International Microwave Symposium (IMS), taking place June 7–12 in Boston, Massachusetts.

Among the products being featured is AuLTRA® 75, an off-eutectic AuSn preform solution (75Au/25Sn) designed for applications using a die with thick gold plating, such as GaN dies used in high-frequency, high-power RF power amplifier devices for 5G, military, and aerospace wireless communications. AuLTRA® 75 is designed to adjust the final solder joint composition and improve wetting and voiding. The AuLTRA® product line is also available in 78Au/22Sn and 79Au/21Sn compositions.

Indium Corporation will also showcase AuLTRA® DA0001, a gold-based die-attach preform solution. Features include:

• Highly accurate thickness control
• Precise edge quality
• Optimized cleanliness
• Default waffle pack method
• Available for gold-based alloys

In addition, the company will feature several other gold-based die-attach solutions:

• AuLTRA® ThInFORMS® are 0.00035-inch-thick (0.00889 mm or 8.89 μm) 80Au/20Sn preforms designed for high-output laser applications. The preforms are intended to address issues such as shorting and thermal transfer.
• AuLTRA® Fine Ribbon is Indalloy®182 fine-grade precision ribbon designed for high-volume, automated laser diode assembly processes. The product is intended for auto-feed systems that require precision ribbon, spooling quality, and continuous lengths to support production processes.
• AuLTRA® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste formulated for the elevated processing temperatures of gold-based alloys. The product is intended for high-power LED module array assemblies and features long stencil life, tack performance, wetting, and voiding characteristics.
• AuLTRA® 5.1 is a no-clean AuSn solder paste formulated for the higher temperatures associated with Au-based alloys. The product is designed for high-power LED module array assemblies and supports fine-pitch printing, wetting performance, and void minimization while meeting printing and reflow requirements.

Indium Corporation will present these Au-based die-attach solutions at IMS 2026 in Booth 21054.

Click here to learn more about the Indium Corporation's precision Au-based preforms.

Event

IEEE International MTT Symposia (IMS) 2026