San Francisco Circuits Offers High-Reliability Burn-in Boards for Component Stress Testing

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San Francisco Circuits, a specialist in a wide range of printed circuit boards (PCBs), including flex, metal-core, and military designs, provides expertly engineered burn-in boards that ensure component reliability through rigorous pre-use testing. These boards are specifically designed to support the demanding process of burn-in, where components are intentionally stressed to reveal potential failures before deployment in the field.

Burn-in is a critical procedure performed on electronic components prior to regular operation. During this process, components are exposed to elevated stress conditions to detect early-life failures and verify long-term performance. Typically, samples are placed on a burn-in board and subjected to a controlled oven environment at 125 °C while electrical excitation is applied. The electrical bias can be either static or dynamic, and the oven maintains the required temperature throughout the test. By replicating extreme operating conditions, burn-in helps manufacturers identify weak components and ensure that only the most reliable parts make it into finished products.

The company’s standard technology supports a wide range of specifications to meet diverse project needs. Boards can be manufactured with one to eighteen layers using materials such as 370HR, BT, Polyimide, and Nelco 4000-13. Thickness options range from 0.062 to 0.125 inches, with board sizes available up to 19 by 23 inches. These boards maintain a hole aspect ratio of 12:1 and a minimum hole size of 0.006 inches. Controlled impedance tolerance is held to ±10 percent, while the minimum trace and space specification is 0.004 inches. The smallest surface-mount device (SMD) pitch supported is 0.006 by 0.006 inches. Available finishes include ENIG, HASL, Hard Gold, and Tin-Nickel.

For more complex requirements, San Francisco Circuits offers advanced technology solutions capable of supporting between twenty and thirty layers. These boards use the same high-performance materials—370HR, BT, Polyimide, and Nelco 4000-13—but can be manufactured with thicknesses from 0.125 to 0.250 inches and in sizes up to 23 by 27 inches. The advanced process increases the hole aspect ratio to 15:1 and reduces the minimum hole size to 0.005 inches. Controlled impedance tolerance is tightened to ±5 percent, while the minimum trace and space specification is 0.003 inches. The minimum SMD pitch is 0.003 by 0.003 inches, and available finishes include Hard Gold, ENIG, and Tin-Nickel.

From single-layer prototypes to complex 30-layer boards, San Francisco Circuits delivers burn-in boards that meet the most demanding electrical, thermal, and mechanical requirements. By combining precise engineering capabilities with a global manufacturing network, the company ensures that every board provides the reliability and consistency essential for high-stress component testing and long-term performance.

Click here to learn more about Burn-in Boards from San Francisco Circuits.