San Francisco Circuits, Inc

(0 reviews)
  • Type: Manufacturer, Assembly, Design
  • United States, California, San Mateo
  • +1-800-SFC-5143
  • 1660 S Amphlett Blvd #200 San Mateo, CA 94402

With the resources of a strong network and the expertise of our team members, San Francisco Circuits provides you with a unique one stop solution to all your printed circuit needs, including PCB design, PCB manufacturing and PCB assembly.

Certifications : ISO 9001:2015, ITAR

PCB Assembly Capabilities

BGA Pitch

0.3 - 0.4 mm

Parts Procurement

Turnkey, Consignment, Partial turn-key

Coating

Conformal coating

Time Line General Display

1 - 5 Days

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP
  • ?BGA

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

Capabilites

General
Number of Layers1 - 12
Board MaterialsFR4, FR406, IS410, Kapton, Shin-Etsu - Epoxy, Rogers - Epoxy, Dupont FR - FR Acrylic, Dupont LF - LF Acrylic, Adhesiveless Base Materials
Maximum Board Size16
Copper Thickness0.5 oz - 3 oz
Hole Aspect Ratio7:1
Minimum Hole Size0.008
Minimum Trace/Space0.006
Minimum Drill-to-Copper0.010
Minimum Pitch1 mm
Final FinishHASL (Solder), Lead Free Solder, Copper, Gold, Gold Fingers, White Tin, OSP
Solder MaskGreen, Black, Red, Blue, Yellow, White, Clear
CoverlayFR Coverlay, LF Coverlay, Shin-Etsu, Flexible Soldermask
Silk ScreenWhite, Black, Yellow
PCB FabricationScoring, Route & Retain
Additional FeaturesPlated Slots, Non-plated Slots, Controlled Dielectric, Covered Vias, Counter Sinks, Counter Bores, Dual Access Flex, Suspended Leads
Quality StandardsIPC 6012 Class 2, Electrical Testing, 100% Netlist Testing, TDR Testing
Minimum Board Thickness
2 layer0.010
4 layer0.020
6 layer0.020
8 layer0.062
10 layer0.062
12 layer0.062
Maximum Board Thickness
2 layer0.125
3-12 layer0.200
General
Number of Layers14 - 40
Board MaterialAluminum Core
Arlon
CEM
Copper Core
FR408
Getek
Nelco 4000
Rogers 3000
Rogers 4000
Rogers 5000
Taconic TLY
Polyimide
Maximum Board Size10
Copper Thickness4 oz - 6 oz
Hole Aspect Ratio15:1
Minimum Hole Size0.006
Minimum Trace/Space0.003
Minimum Drill-to-Copper0.003
Minimum Pitch0.3 mm
Final FinishHASL, Gold (ENIG/Hard/Soft), Selective Gold, Immersion Silver, OSP, White Tin
Solder MaskGreen, Black, Red, Blue, Yellow, White, Clear, Mix-and-match, Wet Mask, Dry Film
Silk ScreenWhite, Black, Yellow, Green, Red, Blue
PCB FabricationJump Scoring, Route & Retain, Milling
Additional FeaturesPlated Edges, Plated Milling, Plated Counter Bores & Counter Sinks, Edge Castellation, Controlled Impedance, Silver Filled Vias, Non-Conductive Filled Vias
Quality StandardsMilspec 31032, Milspec 55110, Milspec 50884, IPC 6012 Class 3, 100% Netlist Testing, TDR Testing
Minimum Board Thickness
2 layer0.005
4 layer0.010
6 layer0.031
8 layer0.040
Maximum Board Thickness
14-40 layers0.250

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