San Francisco Circuits, Inc

(0 reviews)
  • Type: Manufacturer, Design, Assembly
  • United States, California, San Mateo
  • +1-800-SFC-5143
  • 1660 S Amphlett Blvd #200 San Mateo, CA 94402
  • Certifications : ISO 9001:2015, ITAR

With the resources of a strong network and the expertise of our team members, San Francisco Circuits provides you with a unique one stop solution to all your printed circuit needs, including PCB design, PCB manufacturing and PCB assembly.

PCB Assembly Capabilities Get PCB Assembly Quote

Coating

Conformal Coating

Fine Pitch

0.3 mm

BGA Pitch

0.4 mm

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided
  • Double Sided

Assembly Type

Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Capabilites

General
Number of Layers1 - 12
Board MaterialsFR4, FR406, IS410, Kapton, Shin-Etsu - Epoxy, Rogers - Epoxy, Dupont FR - FR Acrylic, Dupont LF - LF Acrylic, Adhesiveless Base Materials
Maximum Board Size16
Copper Thickness0.5 oz - 3 oz
Hole Aspect Ratio7:1
Minimum Hole Size0.008
Minimum Trace/Space0.006
Minimum Drill-to-Copper0.010
Minimum Pitch1 mm
Final FinishHASL (Solder), Lead Free Solder, Copper, Gold, Gold Fingers, White Tin, OSP
Solder MaskGreen, Black, Red, Blue, Yellow, White, Clear
CoverlayFR Coverlay, LF Coverlay, Shin-Etsu, Flexible Soldermask
Silk ScreenWhite, Black, Yellow
PCB FabricationScoring, Route & Retain
Additional FeaturesPlated Slots, Non-plated Slots, Controlled Dielectric, Covered Vias, Counter Sinks, Counter Bores, Dual Access Flex, Suspended Leads
Quality StandardsIPC 6012 Class 2, Electrical Testing, 100% Netlist Testing, TDR Testing
Minimum Board Thickness
2 layer0.010
4 layer0.020
6 layer0.020
8 layer0.062
10 layer0.062
12 layer0.062
Maximum Board Thickness
2 layer0.125
3-12 layer0.200
General
Number of Layers14 - 40
Board MaterialAluminum Core
Arlon
CEM
Copper Core
FR408
Getek
Nelco 4000
Rogers 3000
Rogers 4000
Rogers 5000
Taconic TLY
Polyimide
Maximum Board Size10
Copper Thickness4 oz - 6 oz
Hole Aspect Ratio15:1
Minimum Hole Size0.006
Minimum Trace/Space0.003
Minimum Drill-to-Copper0.003
Minimum Pitch0.3 mm
Final FinishHASL, Gold (ENIG/Hard/Soft), Selective Gold, Immersion Silver, OSP, White Tin
Solder MaskGreen, Black, Red, Blue, Yellow, White, Clear, Mix-and-match, Wet Mask, Dry Film
Silk ScreenWhite, Black, Yellow, Green, Red, Blue
PCB FabricationJump Scoring, Route & Retain, Milling
Additional FeaturesPlated Edges, Plated Milling, Plated Counter Bores & Counter Sinks, Edge Castellation, Controlled Impedance, Silver Filled Vias, Non-Conductive Filled Vias
Quality StandardsMilspec 31032, Milspec 55110, Milspec 50884, IPC 6012 Class 3, 100% Netlist Testing, TDR Testing
Minimum Board Thickness
2 layer0.005
4 layer0.010
6 layer0.031
8 layer0.040
Maximum Board Thickness
14-40 layers0.250

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