San Francisco Circuits Provides HDI PCB Micro Circuits for High-Density Electronic Applications

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San Francisco Circuits, a U.S.-based printed circuit board (PCB) solutions provider offering PCB fabrication, assembly, and supply chain services, provides high-density interconnect printed circuit board (HDI PCB) micro circuits designed to support compact electronic designs with higher wiring density per unit area compared to conventional circuit boards. The HDI PCB technology enables more electronic components to fit within limited board space while supporting improved electrical performance and reduced equipment size and weight.

HDI PCBs incorporate design features such as microvias, capture pads, finer lines and spaces, and increased connection pad density. These characteristics support applications where board space and component density are critical. HDI technology is commonly used in products such as mobile phones, personal computers, MP3 players, game consoles, and other compact electronic devices.

San Francisco Circuits offers HDI PCB micro circuits with several structural characteristics, including blind and buried vias, via-in-pad structures, and through vias from surface to surface. Additional design parameters include circuit geometries of 20 µm, dielectric layers of 30 µm, laser vias of 50 µm, and bump pitch processing of 125 µm. The company’s HDI PCB capabilities are used across multiple industries, including semiconductor test equipment, defense systems, medical devices, and aerospace applications.

Also Read: What are the Differences Between Blind Vias and Buried Vias?

HDI PCB micro circuits also support technologies such as flip chip, ball grid array (BGA), multi-chip module (MCM), and system-in-package (SiP). The technology allows the use of ultra-thin cores, fine line geometries, and alternative via structures that support thermal transfer requirements in thermal PCB designs. The compact layout of HDI PCBs allows components to be placed closer together, which can support faster signal transmission and reduced signal loss.

San Francisco Circuits supports HDI PCB production with several laminate material options. These include high Tg BT resins, low Dk and low Df formulations, high-strength low CTE materials, polyimide/Kapton laminates, and multifunction FR-4 materials. Copper cladding options include minimum cladding of ½ oz and maximum cladding of 2 oz, with minimum board thickness down to 0.03 mm (0.0012 in).

The company also supports various PCB construction methods, including controlled dielectric thickness, controlled impedance with ±2% tolerance, differential signal structures, and microstrip and stripline configurations. Additional capabilities include multilayer build-ups of up to 12 layers, blind and buried vias, flexible structures down to 0.025 mm (0.001 in), conductive hole plug technology, via-in-pad structures for RF and high-density substrates, and both additive and subtractive PCB fabrication processes. Drilling capabilities include mechanical, laser, and plasma drilling methods, with minimum drill hole sizes of 0.025 mm (0.001 in).

San Francisco Circuits also provides multiple surface finishing processes. These include wirebondable structures, differential metallization processes, electrolytic and electroless plating, full body, selective and contact gold finishes, and immersion silver surface finishes.

Line and space capabilities include minimum line widths of 0.020 mm (0.0008 in) and minimum spacing of 0.020 mm (0.0008 in). Trace tolerances include ±5% for ¼ oz internal layers and ±15% for 1 oz internal layers. Engineering software used in the process includes Valor Genesis 2000. Electrical testing capabilities include high-density flying probe testing, netlist comparison, and automated optical inspection (AOI).

San Francisco Circuits also provides heatsink attachment services using OFHC copper or 6061-T6 aluminum, conductive adhesives with precision tolerances, and cavity fabrication processes. Laboratory services include thermal stress and cross-section testing, dielectric spacing verification, and plating process control. The company also provides flexible HDI PCB solutions as part of its broader PCB manufacturing and assembly capabilities.

Click here to learn more about the HDI PCB Micro Circuits by San Francisco Circuits.