VP7000-200

The VP7000-200 from ASSCON Systemtechnik-Elektronik GmbH is a Vapor Phase Vacuum Reflow Soldering Equipment that is equipped with patented Multi Vacuum technology. It has a single-lane transport and accommodates PCB sizes of up to 520 x 450 mm & 1040 x 450 mm (with a longboard) and components of up to 55 mm in height. This inline system has a soldering cycle that includes up to three vacuum steps per cycle to remove voids from the solder joint before the solidification phase has taken place.  

The VP 7000-200 applies vacuum before and during the solder paste melting phase to eliminate voids, making reliable solder joints. It supports dynamic profiling, a process for automatically controlling the optimum soldering profile in series production, and prevents overheating or destruction of electronic components. This reflow soldering equipment has a smart energy management system that reduces consumption by up to 70%. It supports full traceability, allowing complete process tracking to meet quality control and regulatory standards.