Gold Phoenix PCB Co

(0 reviews)
  • Type: Manufacturer, Design, Assembly
  • China, Wuhan , HuBei 
  • 1-888-PCB-9518
  • LUO YU ROAD #889, The Optical Valley International Plaza #A ROOM 2503 HONG SHAN DISTRICT, HuBei ,Wuhan 430074 CHINA
Gold Phoenix PCB Co.,Ltd. is one of the leading factory in PCB manufacturing in China. It is a branch of Gold Phoenix Tech. Located near the Wuhan Dong Hui Industry Zone, our PCB house was established in 2000. Gold Phoenix PCB specializes in Flex PCB & Rigid PCB prototyping, PCB manufacturing, and PCB assembling, and stencil. The company uses state-of-the-art PCB manufacturing equipment, complimented by the latest inspection equipment for manufacturing close-tolerance boards up to 24 layers. We are proud to offer copper thicknesses up to 6 oz, hidden or blind vias, high frequency, aluminum based and customer specified PCBs. All of our PCB board products are in compliance with UL and GB (China National Standard Committee) GB4588.2, GB4588.4 and IPC-600E standards.

PCB Fabrication Capabilities

Layers

Up to 20 Layers

Board Thickness

0.002 - 0.275 Inches

Board Dimensions

30 x 24 Inches Max

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

Material

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

Manufacture Type

PCB Assembly Capabilities

Board Size

14.5 x 19.5 Inches

Fine Pitch

0.2 mm

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

Assembly Type

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

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