ACME PCB Assembly Provides Potting and Encapsulating Services for Electronic Protection

https://cdn.pcbdirectory.com/news/Untitled_design_12__639189110332124214.webp712370

ACME PCB Assembly, a California-based electronic contract manufacturing company that provides PCB assembly, design, prototyping, and manufacturing services for a wide range of electronic products, provides potting and encapsulating services that protect electronic assemblies from moisture, dust, environmental contaminants, and mechanical stress through low-pressure molding and protective coating solutions.

ACME PCB Assembly provides potting and encapsulating services that use engineered adhesives to seal electronic assemblies, delicate wires, and connectors. The company supports projects from design through production and also offers collaborative engineering and prototyping. After PCB assembly, protective coatings are applied using silicone, polyurethane, or acrylic materials to create water-resistant protection.

The company provides low-pressure injection molding as an environmentally friendly process positioned between traditional potting and injection molding. The process is used to encapsulate and protect PCBs, sensors, switches, batteries, connectors, and other electronic components while offering a cost-effective manufacturing approach.

ACME PCB Assembly states that low-pressure molding enables precise encapsulation, greater design flexibility, and more efficient use of material. The process also supports lightweight product designs by creating accurate protective enclosures around electronic assemblies.

The company applies low-pressure molding across several applications, including:

• Electronic encapsulation and impact resistance to protect fragile components while reducing the need for separate housings, lowering capital investment, and enabling faster production cycles.
• Wire harness strain relief to protect fine-pitch connector assemblies while providing strain relief within the same application.
• LED lighting to protect assemblies from dust, moisture, and vibration, with options for exposed or fully encapsulated LED lenses.
• Micro switches and sensors to simplify molding by eliminating the two-component thermoset curing process.
• Mobile batteries to reduce failure rates compared with traditional potting methods.
• Wire connectors and cable splicing where low molding pressures support connector protection and encapsulation.

Click here to learn more about the potting and encapsulating services.