AdvancedPCB Installs Vaccum via Filling System to Expand HDI Manufacturing Capacity in Santa Clara

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AdvancedPCB has installed a MASS VCP-5000 Vacuum Via Filling System at its Santa Clara facility, expanding capacity for advanced HDI and high-reliability printed circuit board builds in Silicon Valley. The investment is part of the company’s 2026 Technology Acceleration Initiative aimed at strengthening advanced fabrication capabilities across its U.S. operations.

The MASS VCP-5000 is a vacuum chamber plugging system engineered to deliver void-free filling using a controlled vacuum-assisted process. The system supports complex HDI constructions, including stacked and staggered microvias, filled and capped vias, and high-layer-count designs where uniform copper distribution and structural integrity are essential.

As electronic systems continue to shrink while increasing in power density, the quality directly impacts long-term reliability and thermal performance. The VCP-5000 enhances panel-to-panel consistency by ensuring uniform resin fill and stable processing conditions, helping to reduce variability and improve overall yield, particularly in multilayer and high-aspect-ratio applications.

“This investment expands our ability to support customers pushing the limits of HDI complexity and long-term PCB reliability,” said Greg Halverson, CEO of AdvancedPCB. “New designs coming from our customers demand precision at every layer. The VCP-5000 gives us tighter control over one of the most critical steps in high-density board fabrication.”

Located within the semiconductor ecosystem, AdvancedPCB’s Santa Clara facility supports customers developing AI hardware, high-performance computing platforms, and other dense electronic architectures requiring stacked microvias and high layer counts. The addition of advanced vacuum via filling technology further strengthens West Coast manufacturing capability for these demanding applications.

AdvancedPCB’s 2026 Technology Acceleration Initiative includes coordinated investments across multiple U.S. facilities to enhance advanced fabrication processes, increase capacity, and reinforce domestic manufacturing infrastructure for high-performance electronics programs.

Click here to learn more about the MASS VCP-5000 vacuum.