TE Connectivity's Press-Fit Technology Supports PCB Interconnections in Automotive Electronics

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TE Connectivity's press-fit technology provides a solderless PCB interconnection method for automotive electronics, enabling electrical and mechanical connections between contacts and printed circuit boards through compliant press-fit pins. The technology has been used since its introduction in telecommunications in the 1970s and was later adopted for automotive applications in 1988.

Press-Fit Solutions for Automotive Applications

The company provides two press-fit solutions for automotive systems: ACTION PIN and Multispring compliant pins. These designs use elastic press-in zones that deform during insertion, reducing stress on PCB holes while maintaining contact force for long-term electrical and mechanical performance. TE Connectivity notes that the connection can generate low-resistance interconnections through contact forces between the pin and plated through-hole structure.

Its portfolio includes both single-pin press-fit terminals and connector modules for mass termination applications. Single-pin solutions allow flexible PCB layouts, while connector modules can be configured to customer-specific requirements.

Addressing Automotive Electronics Trends

TE Connectivity identifies increasing vehicle electronics content, ECU miniaturization, and higher interconnection density as key industry trends driving demand for compact interconnection technologies.

The company highlights its NanoMQS contact system, which reduces connector pitch and PCB space requirements, and notes the development of the NanoMultispring press-fit pin to support further miniaturization.

The company also notes that future automotive applications may use thinner PCBs, creating additional requirements for press-fit interconnection systems.

Materials and Manufacturing Characteristics

Press-fit pins are produced using base materials combined with under-plating and top-plating layers. Typical constructions include copper-based alloys with nickel under-plating and tin surface finishes. The technology supports insertion into plated through-hole PCB structures without the need for soldering processes.

Alternative to Conventional Soldering

TE Connectivity states that press-fit technology eliminates the need for soldering during PCB assembly, reducing exposure of components to elevated soldering temperatures and enabling the use of standard resin materials instead of specialized heat-resistant plastics. The technology can also be applied after surface-mount assembly, allowing large connector headers to be installed without affecting reflow soldering processes.

The company cites reliability data indicating that press-fit connections provide a low failure rate compared with several other electrical connection methods.

Application Benefits

According to TE Connectivity, press-fit technology offers:

• Solderless PCB termination
• Fast processing and automated insertion
• Flexible pin-array configurations
• Single-pin and stand-alone insertion capability
• Flux-free and lubrication-free processing
• Elimination of solder paste printing and pre-heating
• Reduced risk of solder-related defects
• Compatibility with automated manufacturing environments

Automotive Application Areas

The technology is used across a range of automotive applications, including:

• Electronic control units (ECUs)
• Pin header assemblies
• Integrated housings and modules
• ABS and ESC systems
• Sensor housings
• Anti-theft antenna modules
• PCB-to-PCB interconnections
• Capacitor holder assemblies

Tooling and Production Equipment

TE Connectivity supports press-fit manufacturing with dedicated insertion and connector seating equipment. The portfolio includes manual and automated single-pin insertion systems, force-monitoring capabilities, programmable positioning functions, and connector seating presses designed for PCB assembly environments. The company also provides tooling options for process monitoring, traceability, PCB measurement, and automated production-line integration.

Future Developments

The company is developing the NanoMultispring press-fit pin to address increasing miniaturization requirements and smaller PCB hole diameters. TE Connectivity is also working on new plating technologies aimed at reducing tin whisker formation while maintaining compatibility with evolving PCB surface-finish technologies, including immersion tin, immersion silver, immersion gold, and OSP-coated boards.

Click here to learn more about the press-fit technology.