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AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, has announced its participation in the upcoming SMTA Tampa Bay Expo & Tech Forum taking place on November 12 at the Largo Event Center in Largo, Florida. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die-attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and discover all of AIM’s products and services, visit the company at the SMTA Tampa Bay Expo & Tech Forum on November 14.
Click here to learn more about SMTA Tampa Bay Expo & Tech Forum.
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