ASMPT SMT Solutions to Showcase Electronics Manufacturing Innovations at APEX EXPO 2026

https://cdn.pcbdirectory.com/news/700375_5__639051864765517623.webp712370

ASMPT SMT Solutions will present its latest innovations in electronics manufacturing at APEX EXPO 2026, taking place March 17 to 19 in Anaheim, California. At booth 1813, visitors will be able to see the company’s new SIPLACE V placement platform, the DEK TQ XL solder paste printer, and additional hardware and software developments. The booth will also feature solutions from ASMPT Semiconductor Solutions for the semiconductor industry, as well as offerings from ASMPT’s software subsidiary Critical Manufacturing, which will present its manufacturing operations platform.

The new SIPLACE V platform, which made its debut at Productronica 2025, will be a key highlight at the event. The system delivers performance increases of up to 30 percent under real-life operating conditions in the production of consumer electronics, automotive and industrial products, smartphones, and IT and network infrastructure components.

The SIPLACE V combines high performance with quality and flexibility, supporting components ranging from miniaturized 016008M chips to large and odd-shaped components. It provides 90 feeder slots regardless of installed options and features a compact footprint of 1.1 by 2.4 meters. The platform is fully compatible with existing SMT lines and ASMPT’s hardware and software portfolio, and its Gigabit Ethernet-based architecture is designed to support future automation, big data processing, and AI integration. Also on display will be the SIPLACE V L, which offers added flexibility for assembling oversized printed circuit boards.

A complete production line

ASMPT will demonstrate a complete production line at the show, consisting of the SIPLACE V, a DEK TQ L solder paste printer, and the Process Lens SPI system. The company will also showcase the DEK TQ XL solder paste printer, which supports circuit boards up to 850 by 610 mm, with thicknesses up to 8 mm and weights up to 12 kilograms. The system prints across the full PCB surface and maintains repeatable results even on boards with warpage of up to 4 mm. Another exhibit will be the SIPLACE SX placement platform, featuring the enhanced OSC Package for precise assembly of large and complex components such as BGAs and other parts with demanding geometry, weight, and coplanarity requirements.

Software for intelligent manufacturing

ASMPT’s hardware solutions will be complemented by its software portfolio, including the WORKS Software Suite for controlling and optimizing shop-floor workflows, the Factory Equipment Center asset and maintenance management system, and the SMT Analytics expert system, which provides AI-supported process analysis and reporting.

The manufacturing execution system from ASMPT software subsidiary Critical Manufacturing will also be presented. Developed specifically for electronics manufacturing, the platform supports end-to-end process control and production transparency.

Semiconductor solutions and advanced packaging

Another section of the booth will focus on ASMPT Semiconductor Solutions, which offers high-performance bonders and advanced packaging technologies designed to address increasing integration density, shorter innovation cycles, and growing quality and reliability requirements.

“Artificial intelligence, networked communication, electromobility, and new high-performance data centers place high demands on electronics manufacturing,” said Mark Ogden, Marketing Manager Americas at ASMPT SMT Solutions. “Powerful, compact, and reliable hardware with low operating costs is increasingly important, along with measurable gains in technology and productivity. This is where the new SIPLACE V platform, advanced printing and placement solutions, and our end-to-end software portfolio come into play.”

Click here to know more about the APEX EXPO 2026 event.