ASMPT to Showcase Silicon Photonics & Co-Packaged Optics Solutions at ECOC 2025 Exhibition

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ASMPT, the global leader in hardware and software solutions for semiconductor and electronics manufacturing, will showcase its latest innovations at the ECOC 2025 Exhibition, Europe’s leading trade fair for optical communication, taking place in Copenhagen from September 29 to October 1. At Booth 1131 in Hall C of the Bella Center, ASMPT will highlight next-generation technologies for silicon photonics and co-packaged optics (CPO). A major highlight will be the world premiere of the MEGA-P multi-chip bonder.

With decades of expertise in interconnect technologies and a deep understanding of optoelectronics manufacturing, ASMPT is addressing the rising demand for efficient integration of optical components in high-speed data transmission, data centers, and future AI infrastructures.

MEGA-P: High-Precision Multi-Chip Packaging on a Single Platform

Unveiling at ECOC 2025, the MEGA-P is a flexible, high-precision packaging platform designed for complex multi-chip modules in photonics, sensor technology, and optical communications. Its modular architecture combines multiple processes in a single system—including adhesive application, 3D post-dispense inspection, a “look-through” bond head for ultra-high precision, and UV curing. This enables the seamless integration of lenses and photonic components while ensuring efficiency and adaptability.

By merging previously separate machine functions into one intelligent platform, the MEGA-P reduces setup times, increases throughput, and offers unmatched flexibility to meet evolving industry demands.

“The complexity of modern semiconductors poses new challenges, particularly in bonding technology,” said Dr. Johann Weinhändler, Regional Head of ASMPT Semiconductor Solutions and CEO of ASMPT AMICRA. “With the MEGA-P, we provide a platform that replaces entire machine lines while delivering maximum precision and flexibility through its modular design.”

Advanced Solutions for Co-Packaged Optics
NANO - Die Bonder and Flip Chip Bonder

In addition to MEGA-P, ASMPT will present its advanced platforms for co-packaged optics. The AMICRA NANO offers industry-leading placement accuracy, making it ideal for research, prototyping, and complex development projects. Supporting hybrid bonding processes, it enables the integration of photonics and electronics in highly compact designs.

NOVA Pro - Die Bonder and Flip Chip BonderFor volume production, the AMICRA NOVA Pro combines high processing speeds with precision, enabling scalable and automated manufacturing of advanced photonics packages. With flexible material handling and robust automation, it ensures efficiency and reliability in mass production.

Click here to learn more about ASMPT Semiconductor.

Click here to learn more about ECOC 2025 Exhibition.