Benmayor Group Showcases PCB Automation and Thermal Management Solutions at IPC APEX EXPO 2026

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Benmayor Group is presenting PCB automation systems and thermal management materials at IPC APEX EXPO 2026, taking place March 17 - 19 at the Anaheim Convention Center in Anaheim, California. Visitors can meet the company in Exhibit Hall C-D, Booth 4816, where Benmayor brands Technosystem and Aismalibar are demonstrating solutions designed to improve PCB manufacturing efficiency, automation integration, and thermal management performance.

PCB Automation Systems

Technosystem, a Benmayor Group company focused on automation for PCB manufacturing, is exhibiting several automation platforms developed for mid- to high-volume production environments.

The Millennium ECO automation platform is designed to reduce manual handling and prevent panel damage during PCB production. The system uses a six-axis robotic arm with automatic suction-cup adjustment, enabling non-contact panel handling while automatically adapting to different panel sizes in real time. Its compact design allows integration into existing production lines without requiring significant floor space.

Technosystem is also presenting the V3-AOI SINGLE, an automation solution designed to interface with automated optical inspection (AOI) systems from multiple manufacturers. The system uses two six-axis robotic arms and operates with cycle times under 10 seconds, excluding panel exchange. Integrated CCD camera recognition enables real-time panel alignment on the AOI inspection table.

The ERIZO 60 Loader & Unloader is designed for installation at the entry or exit of horizontal processing lines. The system supports a capacity of up to 60 panels and can be configured with one or two conveyors. ERIZO systems are designed for automated handling of inner- and outer-layer panels across wet-process PCB production lines.

Thermal Management Materials

Aismalibar is also presenting advanced thermal management materials designed for high-power PCB applications. Featured products include BOND SHEET CURED 3.2 W/mK, a thermal interface material designed to reduce thermal resistance between power components and heat sinks while maintaining electrical isolation. The company will also showcase GLASS-FREE Bond Sheet materials ranging from 2.0 to 8.0 W/mK for advanced PCB thermal management applications.

Another product on display is the IMS ULTRATHIN substrate, designed to provide low thermal resistance while maintaining high dielectric strength for high-power electronics, with dielectric thickness as low as 35 µm.

Engineers and manufacturing professionals attending IPC APEX EXPO 2026 are invited to visit Booth 4816 to explore Benmayor Group’s automation and thermal management technologies for PCB manufacturing.

Click here to learn more about the IPC APEX EXPO 2026 event on PCB Directory.