GOWIN Semiconductor Partners with JLCPCB to Expand FPGA Access for Prototyping and Low-Volume Production

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GOWIN Semiconductor announced a collaboration with JLCPCB, a PCB fabrication and assembly provider, aimed at improving access to FPGA devices for developers requiring fast prototyping, small-volume production, and hardware development. Through this cooperation, selected GOWIN FPGA devices will be available within JLCPCB’s component ecosystem via LCSC, enabling simplified sourcing alongside PCB fabrication and assembly services. This approach allows developers to move from concept to working hardware, reducing the barriers associated with small-quantity FPGA procurement.

In addition, GOWIN devices are also becoming available through platforms such as HQchip, expanding access for customers seeking sourcing options across different procurement channels.

The collaboration supports a range of users — from makers, students, and open-source developers to commercial engineering teams needing rapid prototyping or low-volume production ahead of scale-up. Initial availability will focus on widely used devices within the open hardware ecosystem, including those commonly deployed in Tang Nano, Tang Mega, and related FPGA development platforms.

"This collaboration reflects our commitment to lowering barriers to FPGA adoption," said Mike Furnival, VP of International Sales at GOWIN Semiconductor. "By cooperating with platforms like JLCPCB, we are enabling developers, educators, and engineering teams to prototype and iterate faster, while maintaining a clear and supported path to scalable production."

Enabling Fast and Accessible FPGA Development

The cooperation with JLCPCB enables rapid prototyping and small-volume builds through integrated PCB fabrication and assembly services. It simplifies access to FPGA devices for makers, students, startups, and commercial R&D teams, while supporting fast hardware iteration without complex sourcing requirements or minimum order constraints.

Supporting Flexible Paths from Prototype to Production

GOWIN continues to support customers across the full development lifecycle through a complementary, multi-channel approach.

This includes:

• Collaboration with JLCPCB for prototyping and low-volume production
• Availability through distribution platforms such as HQchip for component sourcing
• Direct engagement with GOWIN’s global sales organization for volume production, long-term supply assurance, and technical support

Selected GOWIN FPGA devices are expected to become available through JLCPCB’s component ecosystem in the coming months, with additional devices introduced based on community and customer demand.

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