IEEE ECTC 2026 Announces Student Innovation Challenge for University Students

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The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference (ECTC), has announced a Student Innovation Challenge for ECTC 2026, the conference’s 76th anniversary. Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance, including travel costs up to a specified amount.

More than 2,000 scientists, engineers and businesspeople from more than 20 countries are expected to attend the 76th annual ECTC, which will take place May 26-29, 2026, at the JW Marriott & Ritz-Carlton Grande Lakes Resort in Orlando, FL.

“This is a wonderful opportunity for students to have a platform to showcase innovative technical skills to packaging experts from industry and academia, through competition with other student teams from around the world," said Przemyslaw Gromala, ECTC 2026 Vice General Chair and Sr. Expert & Simulation Team Leader at Robert Bosch GmbH. “The finalist student teams gain exposure to the conference’s state-of-the-art technical program and packaging experts; networking with potential employers, including potential internships; and will have the opportunity for their work to be published in the highly regarded technical journal, IEEE Transactions on Components, Packaging and Manufacturing Technology.”

The 2026 ECTC Executive Committee is inviting teams of up to three students – eligible participants should be currently enrolled in an undergraduate (BSc) / master’s (MSc) program, or doctoral (PhD) candidates from any university. Interested student teams must pre-register by December 31, 2025, for one of the following three pre-defined challenges, each one dealing with a critical aspect of simulation and reliability in electronic packaging.

Key Topics Accepted at the IEEE ECTC 2026 Student Innovation Challenge

For BSc and MSc students

Low-cost Robust Thermal Solution for High Power AI/Datacenter Processor

For PhD students

• Materials, Interfaces, & Processes for Ultra-Scalable Interconnects
• Electromigration Solutions for BGA Interconnects in AI-Focused Packages

On January 19, 2026, teams must submit reports with their results and findings for the award and the organizing committee will announce six teams selected for the finalist round of the competition on February 16, 2026. These teams will have until May 15, 2026, to finalize their work and submit their presentations.

Click here to learn more about IEEE ECTC 2026.