Koh Young to Discuss Data-Driven SMT Process Transparency at EPP InnovationsFORUM+ 2026

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Koh Young Technology, a provider of True 3D measurement-based inspection solutions, will discuss data-driven transparency in electronics manufacturing at the EPP InnovationsFORUM+ 2026, scheduled for April 15, 2026, at the Böblingen Congress Hall in Germany. The event brings together experts from the electronics manufacturing ecosystem to explore developments in automation, artificial intelligence (AI), sustainability, and smart manufacturing.

As part of the conference program, Axel Lindloff of Koh Young Europe will present “From Quality to Resilience: How Data-Driven Transparency Ensures Delivery Capability,” examining how transparency across the surface-mount technology (SMT) process can help manufacturers respond to disruption and variability.

Resilience refers to the ability to deal with internal and external stressors without escalation. In manufacturing environments, stressors can include fluctuating delivery quality, new materials, inexperienced employees, or unstable processes. When these factors occur together, the system can escalate, resulting in scrap, downtime, delays, and reactive decisions, often due to limited process visibility. Resilience develops through transparency. In production environments, this refers to data transparency across the entire manufacturing process.

SMT lines generate large volumes of data. However, the value of this data depends on context. Consistent 3D measurement technology during printing, assembly, and soldering provides quality-related measurements along the entire line. Combined with AI-driven analytics, deviations can be detected at an early stage, processes can be monitored, and root causes can be identified.

“Manufacturers today face growing variability, whether from materials, supply chains, workforce changes, or evolving product complexity,” said Axel Lindloff of Koh Young Europe. “True 3D measurement data across the SMT process provides the transparency needed to detect issues early, stabilize production, and maintain delivery capability even as conditions change.”

Beyond individual inspection points, manufacturers increasingly benefit from connecting measurement data across the production line. Koh Young’s software and smart factory solutions connect inspection results to support analysis of trends, identification of process interactions, and response to deviations. This approach allows manufacturers to use measurement data to support stable and predictable production.

Koh Young’s True 3D SMT inspection and metrology systems provide measurement data across manufacturing stages including solder paste printing, component placement, and reflow soldering. Unlike inspection methods that infer process conditions from image-based inspection alone, measurement-based technology provides height and volume data that can be used to evaluate process variation and implement process control.

The EPP InnovationsFORUM+ 2026 focuses on themes influencing electronics production, including AI and digitization, automation, sustainability, and smart manufacturing. The forum provides a platform for industry experts to exchange ideas and discuss technologies related to production environments.

Click here to register for the EPP InnovationsFORUM+ 2026.