Kurtz Ersa Introduces New Rework System with Automated Residual Solder Removal at Electronica 2024

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At Electronica, the world´s leading trade fair for electronics production in Munich, systems supplier Ersa presented its new high-end model for component repair, the HR 600P. Component repair with the HR 600 P pays off in two ways – economically because it allows added value to be maintained and faulty boards do not have to be disposed of, and sustainably because it enables resource-saving production. Reliable and with the highest degree of automation.

The table-top rework system with automatic residual solder removal sets new standards in terms of automation and drives the professionalization of repairing electronic assemblies. The solid and highly accurate machine frame of the HR 600P is the basis for precise component placement and reliability. Reproducible soldering results are provided by the proven infrared heating elements in the bottom-side emitter, which heat the assembly homogeneously. The highly dynamic hybrid heating head is designed for maximum performance and ensures targeted and efficient component heating from above by combining infrared radiation and convection heating.

High-precision thermocouples or the non-contact, digital Virtual Thermocouple (VTC) can be used for closed-loop temperature control. The exact component position is automatically calculated, and the component is placed with a vacuum gripper via the precise axis system. A high-performance reflow process camera with LED illumination is used for process monitoring and documentation. All operations are monitored and documented by the HRSoft 2 operating software (for Windows). The HR 600P can also be connected to customer MES systems via HRSoft 2.

The HR 600P is available in different versions to enable it to be optimally adapted to individual processing priorities. In the version with a large PCB holder, the user can process larger assemblies of up to 642 x 423 mm. A version with a lowered heating cassette creates additional free space on the underside of the assembly for tall structures. Both versions can be combined. The HR 600P is prepared for use with the Ersa Dip&Print Station, which reliably applies a defined amount of flux or solder paste to the components. Before a new component can be soldered onto a PCB, the solder remaining on the circuit board after desoldering must be removed. For this purpose, the Auto Scavenger SC 600 scavenging module is available as an option to extract the remaining solder from the pads in an automated process without touching the PCB surface. The scavenging module can be retrofitted to the HR 600P and is fully integrated into the HRSoft 2 software.

With gentle IR or hybrid heating, precise temperature control and a placement quality better than +/- 50 μm, a range of components from 1 x 1 mm to 60 x 60 mm can be desoldered, placed and soldered automatically

The optional SC 600 scavenger module automatically ensures reproducible non-contact residual solder removal – without the risk of mechanical damage due to manual intervention

Image of a cleaned circuit board with approx. 20 μm residual solder

Click here to learn more about HR 600P from Kurtz Ersa.