https://cdn.pcbdirectory.com/news/Untitled_design_1__639129576819955688.webp712370
LPKF, a provider of laser-based manufacturing solutions for electronics, specializing in PCB prototyping, micromachining, and precision material processing, provides laser drilling and cutting technologies for PCB manufacturing, covering rigid PCBs, flexible PCBs (FPCBs), and coverlays, with a focus on stress-free material processing and production efficiency.
The company’s CleanCut and short pulse technology operate within an optimized pulse duration range for PCB material processing. In short pulse regimes, pulse duration affects processing efficiency, particularly in industrial applications where total processing time is critical.
LPKF states that its laser systems support easy handling, small system footprint, and short changeover times. The systems enable use of base material and production time in on-demand manufacturing environments.
The company identifies four main outcomes from its laser processing approach:
- Increased yield: Microvia drilling supports higher yield during plating through consistent via shape.
- Increased reliability: CleanCut technology reduces carbonization during cutting, supporting PCB lifetime.
- Increased productivity: Coverlay cutting is dust- and burr-free and does not require cleaning.
- Increased profit potential: Line and space ratios below 20 µm enable development of next-generation products.
LPKF also presents its PicoLine laser systems, developed on the MicroLine platform, for higher demands in laser manufacturing quality. These systems use pico-second pulse lasers for precise positioning and processing of PCB materials including FR4, PI, LCP, and PTFE-FPC across standard panel sizes. The short pulse technology reduces the heat-affected zone (HAZ) to negligible levels.
The laser systems are designed for micromachining applications in continuous manufacturing environments where system uptime is critical. LPKF's systems are used in high-speed, high-quality PCB-related applications across multiple industries.
The company lists several application areas:
- Microvias: For microvias, LPKF states that its laser processes support a wide range of materials and via shapes. Advantages include space savings, circuit reliability, RF line termination, and smooth side walls. Typical materials include liquid crystal polymers (LCPs), polyimide (PI), and polytetrafluoroethylene (PTFE).
- PCB routing: In PCB routing, the systems can process panel sizes up to 533 x 610 mm, with a 20 µm UV laser kerf width enabling cutting of fine contours at high speeds.
- PCB skiving: PCB skiving is described as a selective ablation process that removes material without affecting underlying layers,or clears dielectric material without cutting through completely.
- Cavities: For cavities, LPKF notes that laser-produced cavities may show tapered walls depending on material and depth, while its cutting methods enable steep side walls and defined geometries.
- Coverlay cutting: In coverlay cutting, the systems achieve cutting speeds up to 500 mm/s depending on material and layout, with no heat-affected zone, no carbonization, minimal burr formation below 10 µm, and no surface contamination.
- System in Package (SiP) cutting: System in Package (SiP) cutting enables cutting, opening, or drilling of IC compounds, with curved cuts, minimal burring, small heat-affected zones, and precise positioning.
- Ablation of inorganic layers from organic substrates: Removal of thin metal layers from organic substrates for applications such as OLED manufacturing.
- Ablation of organic layers from inorganic substrates: Removal of organic layers from inorganic substrates with precise and cost-efficient processing.
LPKF also outlines its system portfolio, which includes UV, green, and IR laser options. The systems can operate as standalone units or as part of integrated production lines and can be adapted to handling requirements in electronics manufacturing. MicroLine systems operate in the nanosecond pulse range, while PicoLine systems operate in the picosecond range.
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