MKS' Atotech to Showcase Latest PCB and Package Substrate Manufacturing Solutions at APEX EXPO 2026

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MKS, a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming APEX EXPO, held at the Anaheim Convention Center from March 17-19, 2026.

At booth #3626, attendees will experience how MKS’ Atotech and ESI solutions combine advanced process chemistry, precision equipment, software, and laser technologies to enable higher throughput, tighter process control, and enhanced reliability across next-generation electronics manufacturing.

This year’s product presentation will highlight integrated solutions for multilayer, flex/rigid-flex, HDI PCB, and package substrate production to support fine-feature quality and high-reliability applications in smartphones, computing, other consumer devices, automotive electronics, AI, and HPC server infrastructure, and advanced communication systems. These solutions reflect MKS’s continued commitment to enabling technologies that help customers accelerate roadmaps and achieve consistent, repeatable performance from prototype through high-volume manufacturing. Visitors are also invited to discuss emerging technology and roadmaps, sustainability-driven chemical innovations, and solutions supporting the transition to smaller geometries, higher layer counts, and advanced packaging.

MKS’ Atotech continues to strengthen its leadership in next-generation electronics manufacturing through its proprietary Optimize the Interconnect^SM approach. By combining innovations in chemical process engineering, precision plating equipment, software and laser drilling systems, MKS  addresses growing industry demands for fine-feature formation, increased interconnect density, improved signal integrity, and scalable high-volume production.

During the Advanced Electronic Packaging Conference 2026, MKS’ Atotech experts will present the following topics:

March 17 | S7 Advanced PCBs, Substrates, and Interposers, Christopher Seidemann, Global Product Manager Surface Treatment Technology

Introducing a next-generation non-etch adhesion promoter designed for smooth copper and advanced dielectric materials. This new solution delivers exceptional interface stability and dramatically reduces wedge formation, even under the most demanding BMV, thermal, humidity, and chemical stress conditions.

March 17 | S9 Quality and Reliability 1: Ionic Contamination and Temp. Humidity Bias, Neil Patton, Marketing Manager Surface Finishing

Reliability in printed circuit boards depends heavily on minimizing ionic contamination, particularly in harsh automotive environments where heat and humidity accelerate corrosion-related failures. This paper evaluates leading industry test methods and specifications for assessing ionic contamination, with a detailed comparison of how extraction liquids, test procedures, and solder mask properties influence the accuracy and consistency of results.

March 18 | S14 Microvia, Stacked Via & Embedded Circuitry Reliability, Roger Massey, Global Product Manager for Desmear and Metallization

Laser-formed blind microvias have enabled major advances in PCB miniaturization, yet they also introduce long-term reliability challenges – especially in stacked configurations. This paper examines the two predominant plated microvia structures and outlines the critical factors governing their formation to ensure consistent, high-reliability manufacturing.

Chemical process highlights include:

Printoganth^® MV TP2 – High throwing power, vertical e-less Cu for SAP / amSAP technology

Cupraganth^® MV Activation –  Pd-free copper activation revolutionizing advanced packaging

ViaKing^®: Superior graphite-based metallization process, resistant to biological growth and contamination

Cuprapulse^® XP8 –  Vertical pulse plating boosts throwing power, quality, and productivity – ideal for HDI, MLB, and automotive PCBs

Cupracid TP3^® – Advanced solution for conformal copper plating in vertical hoist type systems

InPro^® MVF 2 – Next generation blind micro via filling for HDI production

Aurotech^® G-Bond 3 – Mixed-reaction RAIG electrolyte, featuring 40 μm non-toxic stabilization

PD-Core^®- Low metal electroless palladium bath for ENEPIG and EPAG applications

Pallabond^®2- Electroless palladium (pure), and auto-catalytic gold process for fine L/S and HF applications

Cupraetch^® SR 8000 – Dryfilm and soldermask pretreatment with advanced adhesion performance

EcoFlash^® S 300 U – Differential etching for advanced SAP manufacturing

Novabond^® PX-S2 – Delivers precise signal transmission and strong PCB adhesion through nano-roughening and hybrid bonding

BondFilm^® HP – Next generation of bonding enhancement with optimum process cleanliness for I/L bonding

Equipment highlights include:

vPlate^®- The gold standard for vertical conveyor plating equipment for next-generation
 HDI PCB and package substrates

Uniplate^® P, LB, CP/NP, IP2 – Equipment for desmear, electroless Cu, direct metallization,
 and electrolytic Cu plating

Horizon^® BondFilm, Stannatech – Equipment for oxide replacement and immersion tin

Digital Factory Suite – Cutting-edge industrial digital solutions that drive customer performance and reduce operational cost.

On the laser equipment side, promotions include:

Geode™ platform solutions – Next generation PCB and advanced substrate CO2 and UV laser via drills

Geode™ G2 PCB laser drill – Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via.

Click here to learn more about MKS' Atotech.