MKS to Showcase Advanced PCB Manufacturing Technologies at Electronics Circuit Asia 2025

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MKS Inc., an organization providing transforming technological solutions for leading-edge semiconductor manufacturing, electronics, and packaging, and specialty industrial applications, has announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place from August 20–22 at BITEC in Bangkok. Representing its strategic brands—Atotech® (process chemicals, equipment, software, and services) and ESI® (laser systems)—MKS will spotlight its latest innovations for printed circuit board (PCB) and package substrate manufacturing at Booth #H17.

MKS representatives from both Atotech and ESI will be present at the event, where the company will feature state-of-the-art technologies across lasers, optics, motion control, process chemistry, and advanced manufacturing equipment. These cutting-edge solutions are redefining the landscape of PCB fabrication by addressing complex interconnect challenges and enabling high-reliability, miniaturized electronics for next-generation applications.

Thomas Beck, Vice President & General Manager, Southeast Asia, emphasized Thailand’s strategic advantage, citing its robust infrastructure, seamless connectivity, and business-friendly environment as critical enablers of its growing regional importance. As the electronics industry expands beyond traditional MLB/HDI automotive applications into emerging sectors, MKS continues to lead through technological innovation and industry expertise, empowering customers to navigate this dynamic transition with confidence.

As part of its participation, MKS will also deliver two impactful presentations:

• August 21, 10:30 a.m. — Daniel Schmidt, Global Marketing and Training Director, will present a keynote on global and regional electronics market trends, along with evolving workforce development needs.
• August 21, 11:00 a.m. — Jimmy Kan, OEM Manager, will follow with a deep dive into next-generation PCB technologies, highlighting innovations supporting AI, high-performance computing (HPC) servers, and data center infrastructure.

All attendees are invited to join these sessions for valuable industry insights and technology perspectives.

Featured Chemical Process Solutions from MKS Atotech:

• Aurotech® G-Bond 3: A versatile gold bath enabling Ni/Au, Ni/Pd/Au, and Pd/Au plating for advanced packaging and interconnects.
• Inpulse® 2HF9: Delivers high-reliability BMV filling with minimal surface copper plating, superior planarity, and mass production efficiency for HDI boards.
• Printoganth® U Plus: A trusted standard for HDI PCBs, offering robust Cu-to-Cu interconnections and proven thermal shock performance, widely adopted by top-tier automotive and smartphone OEMs.
• NovaBond® PX-S2: Enhances signal integrity and thermal reliability via nano-roughening and selective adhesion, without altering trace geometry.
• OS-Tech® SIT2: A solderable, eco-friendly organic surface finish compatible with Atotech’s ENIG processes, ensuring multiple reflows and tight coating control.

Equipment Highlights:

• Uniplate® PLB Cu6 (for mSAP): Industry-leading horizontal plating system offering energy-efficient fine-line copper interconnect formation with reduced handling complexity.
• Geode™ Platform: CO2 and UV laser via drilling solutions for advanced PCB and substrate manufacturing.
• Capstone™: High-performance UV drilling tool engineered for flex PCB applications, delivering exceptional throughput and process quality.

Click here to learn more about Electronics Circuit Asia 2025.

Click here to learn more about MSK.