TTM Technologies Delivers Next-Gen Semiconductor Packaging with Substrate-Like (SLP) PCB Technology

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TTM Technologies, a global manufacturer of technology solutions—including mission systems, RF components, RF/microwave and microelectronic assemblies, and quick-turn, advanced PCBs—offers next-generation semiconductor packaging solutions with its Substrate-Like (SLP) PCB technology. These cost-effective solutions support multi-layer, RF, and chip-on-flex requirements across aerospace, defense, space, medical, and telecommunications markets. TTM’s substrate-like solutions are designed to meet the low-loss, high-speed demands of high-reliability applications.

HyperBGA®

The HyperBGA® fluoropolymer-based coreless semiconductor package enables dies to operate at extremely high speeds. By combining low-loss, low-dielectric-constant materials with stripline cross-sections, it supports signal speeds exceeding 25 GHz, and even greater than 70 GHz over shorter distances.

Its PTFE material compliance, combined with the dimensional stability of a copper-invar-copper (CIC) center plane, ensures long field life by reducing or eliminating common issues such as BGA wear-out, die cracking, delamination, and flip-chip bump fatigue seen in traditional plastic packages.

HyperBGA® is ideal for networking, high-end servers, telecommunications, military, and medical markets—any environment where speed, reliability, and increased signal I/O must align with reduced size, weight, and power (SWaP). This low-stress flip-chip laminate package is also well suited for multi-layer, RF, chip-on-flex, and system-in-package (SiP) applications.

CoreEZ®

The CoreEZ® semiconductor package leverages the HyperBGA® manufacturing platform to deliver a thin-core build-up flip-chip package with dense core vias, using a cost-sensitive material set. It's via density achieves a 199-micron via-to-via core pitch, resulting in a structure that is effectively coreless.

This density is enabled by smaller pads and 50-micron laser-drilled holes, which open up wiring channels through the core. Compared to standard build-up packages with mechanically drilled core vias, CoreEZ® supports up to twice the number of signal layers. It also reduces component costs by enabling die to shrink through die-pad pitch reduction down to 180 microns (and 150 microns for specific applications). The thin core further enhances power distribution and allows efficient chip thermal dissipation into the PCB.

CoreEZ® is a cost-effective, high-performance solution that combines reliability, wireability, and scalability. It is particularly well suited for aerospace applications requiring radiation tolerance, as well as other advanced markets where performance and cost-efficiency are critical.

Click here to learn more about Substrate-Like (SLP) PCB technology.