Seika Machinery to Host Webinar on PCB Slicing Methods and Low-Stress Separation

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Seika Machinery, Inc. will present the second session of its SMI 2026 Summer Webinar Series on Wednesday, July 8, at 10:00 a.m. PDT, focusing on how PCB slicing methods impact board quality, component reliability, and manufacturing consistency.

Titled “PCB Slicing Methods: Comparing Stress, Edge Quality and Process Performance,” the session will examine how different separation techniques influence mechanical stress and finished board quality, and why those differences matter in production.

The webinar will cover commonly used depaneling approaches, including hand breaking, pliers, guillotine cutters, and standard PCB slicers. It will compare the strengths and limitations of each method, along with strain gauge data highlighting the differences in stress introduced during manual separation. Real examples of edge damage and component-related defects will also be reviewed to show what can happen when boards are separated without controlled processes.

A portion of the session will focus on Sayaka PCB slicing systems, including manual, semi-automatic, and fully automated platforms. Presenters will discuss how controlled, low-stress separation helps protect components, improve edge quality, and deliver repeatable results across different production environments.

For manufacturers evaluating alternatives to manual depaneling or looking to improve throughput with automation, the session is designed to provide guidance on selecting the appropriate method based on board design, production volume, and reliability requirements. The webinar is complimentary, but advance registration is required.

Date: Wednesday, July 8, 2026

Time: 10:00 a.m. PDT

Click here to register for the webinar.