Umicore MDS Installs Uyemura Copper Plating Process at Hi-Tech Corporation in North Macedonia

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Umicore MDS, the European distributor for Uyemura, has installed the Thru-Cup® EVF-YF9 copper process for plating blind vias at Hi-Tech Corporation in North Macedonia. Thru-Cup® EVF-YF9 is an electrolytic copper process developed for plating blind vias. It enables the analysis of all additives used, has a long service life, and supports simultaneous plating of through-holes (PTH) and blind vias in panel and pattern technology for HDI printed circuit boards. The process is REACH-compliant.

“The installation at Hi-Tech, carried out in close collaboration with the process supplier Uyemura and the European equipment manufacturer involved, is an example of international cooperation,” said Andreas Groß, Head of PCB Processes at Umicore MDS. “Especially in times when Europe is losing ground in the field of printed circuit board manufacturing and dependence on Asian markets is growing, such projects are particularly important. They demonstrate how European industry can regain its competitive edge – through the careful selection of reliable project partners and trusting collaboration at all levels.”

Hi-Tech Corporation, based in Skopje, manufactures printed circuit boards for applications in automotive, telecommunications, medical technology and industrial sectors.

Milan Stankovic, Director of Manufacturing at Hi-Tech, said: “The new process delivers consistent, high-quality results with short cycle times. Without the support of Umicore and Uyemura, we would not have achieved these results in such a short time. Their technical expertise was crucial – both in configuring the equipment and in ramping up the process.”

Umicore MDS has implemented Uyemura processes at European printed circuit board manufacturers.

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