Unimicron Germany Provides High-Current PCB Technologies for Power Applications

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Unimicron Germany, a PCB manufacturer specializing in advanced printed circuit board technologies for automotive, industrial, and high-reliability electronic applications, provides high-current PCB technologies for applications requiring the transmission of higher or very high currents, using thick copper technology and related advanced solutions for printed circuit boards.

The company states that printed circuit boards designed for high-current applications have been manufactured at Unimicron Germany for many years using thick copper technology. It also notes that when high currents flow only partially on a conventional board, advanced solutions are available.

Unimicron Germany’s high-current portfolio includes four technologies:

• Thick Copper Technology – HiCu PCB: Used for voltage distribution and conducting high currents. Areas of application include the realization of power and signal circuits on one board, relays and fuse boxes, DC/DC converters, and inverters. Listed advantages are cost reduction, simplified installation, and weight reduction.
• Thick Copper Profile Technology – HiCu Profile PCB: Solid copper parts, round and square, are inserted into the internal cores of multilayer printed circuit boards and then pressed. Applications include power electronics, current carrying capacity up to 1,000 A, and combined power and logic functions. Advantages include heat spread, a combination of power and logic, and a reduction in weight and thickness.
• Metal Inlay Technology – Metal Inlay PCB: A solid copper part is pressed into the printed circuit board to dissipate heat generated by a component through the PCB. Applications include e-mobility and automotive, industrial electronics, and lighting technology. Advantages include heat dissipation, flexibility in inlay geometry, and planarity of the inlay to the reference plane.
• Partial Thick Copper Technology – Wirelaid®: Copper wires are embedded on the inner layer of the printed circuit board by means of micro-resistance welding as an alternative to thick copper technologies. Applications include power electronics and high-current applications up to 100 A, and it is also available in a bendable version. Listed advantages include a combination of power and logic, space gain on the outer layer, and cost reduction.

Click here to learn more about the high-current PCB technologies by Unimicron Germany.