Latest PCB (Printed Circuit Board) News | BGA | Page 2

As part of their continued commitment to world-class electronics manufacturing services, Libra Industries has announced the addition of high-precision underfill technology, now fully in-house. This enhancement marks another key step in their mission to offer end-to-end solutions that support the mos... Read More

Global Info Research has published a report that is a detailed and comprehensive analysis of the global Printed Circuit Board Rework Service market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type, and by Application. As the Printed Circuit... Read More

LP Information has released a report titled "Global Ball Grid Array (BGA) PCB Market Growth 2025-2031". This report provides a comprehensive analysis of the global Ball Grid Array (BGA) PCB landscape, with a focus on key trends related to product segmentation, Ball Grid Array (BGA) PCB top... Read More

Test Research, Inc. (TRI), a leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025. The exhibition will take place on May 6, 2025, at the Crowne Plaza Milwaukee Airport, Wisconsin.Visit TRI's stand to discuss how TRI's... Read More

Essemtec has announced that its high-speed solder paste dispenser has been honored with the 2025 EM Innovation Award. The prestigious award was presented during a ceremony held on March 27, 2025, in conjunction with Productronica China at the Shanghai New International Expo Center.The Spider 2025, n... Read More

Essemtec, a Swiss technology company that develops, produces, and distributes high-tech solutions for global electronics manufacturing, has introduced two new placement machines that complement its solution portfolio: the FOX Ultra and the PUMA Ultra, which offer a significant speed increase compare... Read More

Indium Corporation®, one of the leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, booth #1416, taking place March 18-20 in Anaheim, California.Indium Corporation will showcase the following among its fea... Read More

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, has announced its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas. Among other great products, AIM w... Read More

AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, has announced its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum, which will take place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California. AIM will highligh... Read More

Indium Corporation experts shared their technical insight and knowledge on a variety of industry-related topics throughout SMTA International (SMTAI), October 21-24, in Rosemont, Illinois at Booth 2300.Monday, October 21Supercooled Solder Pastes in Low-Temperature Attach Applications by Dr. Yifan Wu... Read More

PDR Rework and Inspection Systems has announced the release of ThermoActive V8, an innovative software solution designed to transform BGA rework processes by offering unmatched precision and efficiency. Tailored for advanced thermal management, ThermoActive V8 ensures flawless rework of BGA and SMD ... Read More

Test Research, Inc. (TRI), has introduced the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.The Core Features 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms,... Read More

INSPECTIS has introduced its new BGA-XL stand, enabling the easy optical inspection of ultra-low clearance BGAs on large PCBAs. Paired with the optional XM lenses, which offer up to 285x screen magnification, the system can inspect components from underneath, ensuring precise and thorough examinatio... Read More

AIM Solder, a global manufacturer of solder assembly materials, has announced its participation in the SMTA International 2024 conference, taking place October 20-24 at the Donald E. Stephens Convention Center in Rosemont, IL.  AIM Solder will be exhibiting at Booth #2725, where attendees can e... Read More

Accelerated Assemblies has established itself as a reputable entity in the printed circuit board (PCB) industry, renowned for its exceptional quick-turn prototype manufacturing and production services offered at competitive prices. With a commitment to swift turnaround times, Accelerated Assemb... Read More

Nano Dimension, a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal and ceramic Additive Manufacturing (“AM”) 3D printing solutions, announced a major enhancement to its Additive Electronics (“AE”) offering from i... Read More

In the realm of semiconductor packaging solutions, innovation is a necessity. TTM Technologies proudly presents its Substrate-Like (SLP) PCB solutions, heralding a new era of high-performance, cost-effective technology poised to revolutionize various industries.The Glue That Holds It All TogetherFor... Read More

In the fast-paced world of electronics, staying ahead often means making the most of smaller components. That's where HDI (High-Density Interconnect) PCBs come into play. Imagineering Inc. leverages HDIs to achieve a higher wiring density per unit area, enabling the utilization of smaller, futur... Read More

Indium Corporation will feature an array of its innovative thermal management solutions at SEMI-THERM 2024, March 25-28, in San Jose, CA. Indium Corporation's Heat-Spring solutions, ideal for TIM2 applications, are compressible, non-reflow metal TIMs. These indium-containing TIMs offer superior ... Read More

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazic will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California... Read More