KOKI Company Ltd. will showcase its E-Series solder paste at PCIM Europe 2026 in Nuremberg, Germany, exhibiting in Hall 6, Booth 345, and bringing a solution to the demands of power semiconductor manufacturing. As power devices such as IGBTs and MOSFETs continue to drive applications in automotive, ... Read More
As electronic systems continue to evolve toward higher frequencies, greater miniaturization, and more demanding operating environments, substrate technologies are being pushed to deliver improved precision, connectivity, and thermal performance. Cicor Group’s thin-film substrate technology rep... Read More
KOKI Solder America has appointed Horizon Sales as the company’s manufacturers’ representative across Wisconsin, Illinois, and Florida. Under the partnership, Horizon Sales will support the promotion and technical sales efforts of KOKI’s solder materials portfolio, including solder... Read More
A collaboration between electrical and chemical engineers at Newcastle University in England has led to the development of “reversible” glue. Aimed at addressing the global electronic waste (e-waste) issue, the development offers an alternative to permanent joining methods such as solder... Read More
Averna, a provider of test, quality, and automated solutions for industries including aerospace, automotive, consumer electronics, industrial manufacturing, life sciences, and telecommunications, provides Design for Testability (DFT) methodologies that support hardware validation, manufacturing test... Read More
Epec Engineered Technologies, a provider of engineered solutions for printed circuit boards, cable assemblies, and custom electronic components across multiple industries, provides PCB manufacturing with embedded resistors for high-speed applications, addressing design complexity and miniaturization... Read More
Essemtec has announced the successful qualification of a solder paste series for high-speed jetting, developed in collaboration with KOKI, a manufacturer of soldering materials. The E170DN-ESS series has been engineered and validated for Essemtec’s solder paste jetting technology, with je... Read More
Miniaturization, robustness, adaptive functions and reliability are decisive factors for the performance of defence and aerospace technologies today. In this environment, nitinol, a nickel-titanium alloy with shape memory effect and superelasticity, is becoming increasingly important as a material f... Read More
As a provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation will present technical sessions on AI applications at SEMICON SEA 2026, May 5–7, in Kuala Lumpur, Malaysia.Monday, May 4, 3:45 p.m. MYTAdvanced Materials Science Solutions for Nex... Read More
Blind Buried Circuits Inc provides high-frequency PCB manufacturing for high-speed communications, telecommunications, and RF microwave technology, supporting signal transmission requirements up to 100 GHz depending on material selection.Blind Buried Circuits Inc manufactures high-frequency and high... Read More
AT&S, a manufacturer of high-end printed circuit boards and IC substrates for applications in electronics and microelectronics, provides substrate-like printed circuit boards (SLPs) as part of its product portfolio, addressing increasing demands for miniaturization in electronic devices.AT&S... Read More
GreenSource Fabrication has announced that it will be exhibiting at PCB East 2026, on Wednesday April 29,2026 at the DCU Convention Center, 50 Foster Street in Worcester, MA. Attendees can visit GreenSource Fabrication at Booth 611 to learn about PCB fabrication and manufacturing approaches.At this ... Read More
Advanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and ... Read More
KYZEN will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 28 at the Jackson Center in Huntsville, Alabama, and the SMTA Atlanta Expo & Tech Forum on Thursday, April 30 at the Gwinnett County Fairgrounds in Lawrenceville, Georgia. The KYZEN Clean Team will highlight AQUANO... Read More
Ohmega Ticer, a manufacturer of embedded resistor materials and high-performance copper foil solutions for printed circuit boards and high-frequency electronics, provides TCR-EHF® ultra-low profile embedded resistor copper foil for high-frequency applications, designed for 5G mmWave, satellite c... Read More
Indium Corporation®, a materials provider for the electronics assembly market, received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder paste products. A presentation ceremony was held at the Productronica China trade sh... Read More
Cistelaier SpA, an Italy-based PCB manufacturer specializing in advanced and custom printed circuit board technologies for complex applications, provides special printed circuit boards that include PCBs manufactured from mixed materials, embedded PCBs, large-size PCBs, and extra-thick printed circui... Read More
Seika Machinery, Inc., a provider of advanced machinery, materials and engineering services, provides the Slot-die Coater by infinityPV, a system designed for thin-film deposition on both rigid substrates and flexible foils. The Slot-die Coater is available in two platform sizes, Mini and Pro, and c... Read More
Advanced Chip & Circuit Materials, Inc. (ACCM) introduced Celeritas SF1600, a laminate and prepreg material designed to address fiber weave skew in high-speed applications. Fiber weave skew is a materials-related issue caused by woven glass creating a spatially periodic dielectric, where differe... Read More
KSG, a provider of printed circuit boards specializing in high-current and thermal management technologies, provides HSMtec® PCB technology that integrates copper elements into printed circuit boards to combine high-current paths, thermal management, and fine conductor layouts within a single PC... Read More
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