Essemtec and KOKI Introduces New Solder Paste Series for High-Speed Jetting Applications

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Essemtec has announced the successful qualification of a solder paste series for high-speed jetting, developed in collaboration with KOKI, a manufacturer of soldering materials. The E170DN-ESS series has been engineered and validated for Essemtec’s solder paste jetting technology, with jetting speeds of up to 1.1 million dots per hour. The qualification expands material options for electronics manufacturing.

A New Series Designed for Advanced Jetting Applications

The E170DN-ESS series includes two variants, Type 5 and Type 6, designed for different precision levels and application requirements:

• S3X70-E170DN-ESS (Type 5) with a particle size of 10–25 μm, offering a balance between speed and reliability
• S3X811-E170DN-ESS (Type 6) with a particle size of 5–20 μm, enabling precision for fine-pitch and advanced packaging applications

Both formulations are based on a Sn3.0Ag0.5Cu alloy and are designed to ensure repeatable jetting performance in production environments.

Engineered for Stability at High Speeds

Designed for non-contact jet dispensing, the E170DN-ESS series combines powder size, viscosity, and controlled rheology to deliver process stability. At high jetting speeds, the material enables dot formation and placement while reducing issues such as clogging, splattering, or solder defects. This performance supports fine-feature applications, irregular geometries, and 3D assemblies.

Collaboration Driving Material and Process Development

The development and qualification of the E170DN-ESS series result from collaboration between Essemtec and KOKI, focusing on aligning paste formulation with jetting performance requirements. By adjusting parameters such as rheology and material behavior under high-frequency jetting conditions, the companies validated solder paste solutions designed to match the capabilities of Essemtec’s systems.

Expanded Material Options

With the introduction of the E170DN-ESS series, Essemtec expands the range of solder pastes qualified for its jetting systems. This provides manufacturers with additional material choices based on application and production requirements, supporting changes in product design and manufacturing processes.

Jetting in Electronics Production

High-speed solder paste jetting can be used alongside stencil printing or as a replacement in high-mix, low- to mid-volume production. It removes the need for stencils, reduces setup time, and allows faster changeovers while maintaining accuracy and repeatability.

Environmental Compliance

The E170DN-ESS series is halogen-free and compliant with environmental standards, supporting manufacturers in meeting regulatory requirements.

Click here to learn more about the E170DN-ESS series.