Latest PCB (Printed Circuit Board) News | Material | Page 3

Indium Corporation, a materials supplier to the electronics, semiconductor, thin-film, and thermal management industries, will showcase its Rel-ion products at Productronica India, taking place April 8–10 in Greater Noida, India. The products target electric vehicle (EV), e-mobility, and elect... Read More

Schweizer, a Germany-based company specializing in advanced printed circuit board (PCB) and embedding solutions, has developed bond PCB (bare die) technology as part of its HDI portfolio, enabling direct chip placement and electrical connection through wire bonding. The approach is designed to suppo... Read More

Epec, a U.S.-based electronics manufacturer providing engineered PCB, cable, and custom electronic solutions for industrial and high-reliability applications, provides various RF/microwave PCB laminate materials used in high-frequency circuit design, including key material characteristics, supplier ... Read More

SolderKing Assembly Materials has launched SAC0307, a new low-silver alloy addition to its SK P2-5 solder paste range. The new product allows manufacturers to review alloy selection while retaining the same flux chemistry and established process settings, offering a practical option for high-mix pro... Read More

CopperDot, a procurement and engineering services company provided by Bosch, focused on sourcing and delivering custom printed circuit boards and electronics manufacturing solutions, outlines the composition, benefits and manufacturing of insulated metal substrate (IMS) printed circuit boards (PCBs)... Read More

Indium Corporation® is showcasing its solder solutions through live demonstrations at APEX Expo 2026, March 17–19, in Anaheim, California. Live@APEX is a collaboration that brings industry partners together to demonstrate materials and equipment in real-time production environments, allowi... Read More

Benmayor Group is presenting PCB automation systems and thermal management materials at IPC APEX EXPO 2026, taking place March 17 - 19 at the Anaheim Convention Center in Anaheim, California. Visitors can meet the company in Exhibit Hall C-D, Booth 4816, where Benmayor brands Technosystem and Aismal... Read More

A team of researchers in the United States has developed a printed circuit board (PCB) that can simply be dissolved in water at end of life. Better yet, this innovation allows recovery of nearly all materials.The University of Maryland (UMD) leads a unique electronics recycling R&D project, dubb... Read More

Dymax, a manufacturer of light-curing materials and equipment, will exhibit at APEX EXPO 2026, held March 17 to March 19, 2026, at the Anaheim Convention Center in Anaheim, California. Visitors can find Dymax in booth 3405, where the company will present UV/LED light-curable solutions for electronic... Read More

atg Luther & Maelzer GmbH and its partner International Electronic Components Inc (IEC) will meet with attendees at the upcoming IPC APEX EXPO, taking place March 17-19 at the Anaheim Convention Center in Anaheim, California. The companies will exhibit in booth 4844.At the event, atg Luther &... Read More

KOKI Solder America, developer and supplier of soldering materials and related process solutions for electronics manufacturing, announced that it will exhibit at IPC APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California. Attendees can visit KOKI at Bo... Read More

VPF GmbH & Co. KG from Sprockhövel has developed a new polyimide adhesive material (VPF item 630900-1001-801): A technically high-performance polyimide system that combines excellent thermal and chemical resistance with very good printability. It is available from 200 m², with impressi... Read More

Tekra has developed strong expertise in lamination, making it a valuable capability for industries that rely on high-performance materials such as printed circuit boards (PCBs). With decades of experience in precision material handling and film conversion, Tekra offers specialized lamination solutio... Read More

YINCAE Advanced Materials has achieved a significant breakthrough in advanced packaging materials with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power elec... Read More

Rogers Corporation’s Direct Bond Copper (DBC) substrate technology, offered under the curamik® brand, has become a key enabler for demanding power electronic designs. This technology is based on a ceramic insulating substrate onto which pure copper is directly bonded through a high-tempera... Read More

Indium Corporation®, a provider of advanced materials solutions for power device packaging, announced that it will showcase its high-reliability product portfolio at CIPS – International Conference on Integrated Power Electronics Systems, taking place March 10 - 12 in Dresden, Germany.Amon... Read More

Amphenol Printed Circuits (APC), a U.S.-based manufacturer of rigid, flexible, and rigid-flex printed circuit boards serving aerospace, defense, space, and advanced technology markets, will attend and exhibit at the American Physical Society’s APS Global Physics Summit 2026, March 15–20,... Read More

Optomec is a leading innovator in additive manufacturing technologies for advanced electronics and metal components. One of the company’s most transformative platforms is Aerosol Jet® Technology, a digital, maskless printing process that enables the fabrication of high-resolution electroni... Read More

Rush PCB Inc. is a trusted PCB manufacturing partner known for delivering reliable, high-quality circuit boards for diverse industries. Among its advanced surface finishing options, Rush PCB offers ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) plating, a versatile and high-perform... Read More

Heraeus Electronics will exhibit at the 2026 APEX EXPO at the Anaheim Convention Center, Booth 1730, where the company will showcase a broad portfolio of assembly materials focused on power module and advanced electronics applications.APEX EXPO 2026: Click here to register for this event.At this yea... Read More