Latest PCB (Printed Circuit Board) News | Material | Page 5

Additive Circuits Technologies (ACT) has positioned itself at the forefront of next-generation electronic interconnect manufacturing with its proprietary additive metallization technologies for advanced printed circuit boards and electronic structures.The company develops and implements unique proce... Read More

KSG offers Iceberg® PCB solutions specifically developed to handle high currents and increased heat dissipation in today’s increasingly powerful electronic systems. By using thick copper structures with mixed copper thicknesses ranging from 105 to 400 µm in the outer layers and ... Read More

EMX US has finalized a distribution agreement with Sun Chemical to serve as an authorized distributor of electronic and printed circuit board (PCB) materials throughout the Eastern United States. Sun Chemical manufactures a comprehensive portfolio of soldermasks, conductive inks, temporary peelable ... Read More

Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) have released two new industry reports- 2025 China PCB Industry Dynamics Observation and 2025 Japan and South Korea PCB Industry Observation, providing a detailed assessment of how artificial intelligen... Read More

SABIC, a global leader in the chemical industry, has announced an additional incremental expansion phase for the production of its specialty oligomers based on polyphenylene ether (PPE) technology. The expansion builds on earlier capacity increases in Asia and addresses the rapidly growing demand fo... Read More

Garner Osborne uses Tannlin foils to manufacture its PCB stencils in a VectorGuard™ format, which are compatible with the DEK VectorGuard™ frame system developed by Tannlin. These foils allow them to reduce stencil costs significantly - with a reduction of around 25% for standard stencil... Read More

Summit Interconnect manufactures high-performance RF and microwave printed circuit boards, a segment experiencing rapid growth as RF technologies move beyond traditional military and aerospace applications into a wider range of commercial products. The company notes that today’s smaller form-f... Read More

Indium Corporation has announced the global release of SiPaste® C312HF, a halogen-free, cleanable solder paste engineered for ultra-fine-feature printing in advanced semiconductor and system-in-package (SiP) applications. Formulated with Type 7 powder and supporting aperture sizes as small as 60... Read More

PCBAIR has announced the launch of its advanced 8-layer glass core PCB manufacturing capabilities, integrating proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL). The new glass substrate platform delivers superior signal integrity and thermal stability, addre... Read More

Although aluminum offers lower weight and significantly lower cost than copper, conductor tracks on circuit boards have remained almost exclusively copper-based due to aluminum’s extremely limited solderability. Plasma Innovations now reports that it has overcome this longstanding barrier.Usin... Read More

MKS Inc., a provider of enabling technologies, announces its participation in the HKPCA Show, taking place December 3-5 at Shenzhen World Exhibition & Convention Centre. Under its strategic brands, Atotech® – offering process chemicals, equipment, software, and services – and ESI... Read More

Japanese deep-tech startup Elephantech has launched a cutting-edge 15 nm class copper nanofiller, the smallest class of its kind available globally. The breakthrough positions Elephantech among the first companies in the world to offer such advanced nanomaterial for commercial deployment.  &nbs... Read More

Ventec International Group will present its advanced materials at Productronica 2025 in Munich, running from November 18 to 21. The company will highlight materials from its "Glass Free Revolution," including new pre-preg and thermal-bond bondply, including high-performance RCF and RCC des... Read More

Essemtec has introduced the Tarantula Dual Lane, their most advanced dispensing platform, designed to redefine flexibility, speed, and scalability in modern electronics production.The new dual-lane architecture enables processing on two independent lanes. Built on Essemtec’s adaptive modular c... Read More

BENMAYOR S.A., parent company of Aismalibar and Technosystem, will present its latest innovations in thermal management materials and PCB automation systems at Productronica 2025, the world’s leading trade fair for electronics development and production. This year marks the 50th anniversary of... Read More

A research team at the Swiss Federal Laboratories for Materials Science and Technology (Empa) has developed a fully biodegradable printed circuit board (PCB) made from lignocellulose, a natural wood-based material. The innovation could mark a major step forward in addressing one of the electronics i... Read More

Vexos, a provider of electronics manufacturing and custom material solutions, offers medical electronics manufacturing services for various OEMs, specializing in cutting-edge medical devices. From intricate electronic medical equipment, including X-Ray computed tomography (CT), positron emission tom... Read More

MacDermid Alpha Electronics Solutions, a global leader in chemicals and materials for electronic manufacturing, has announced the opening of its expanded laboratory in Bangkok, Thailand. The new facility is part of the company’s broader strategy to strengthen its local presence in Southeast As... Read More

Detection Technology Plc, a global leader in X-ray detector solutions, has announced the launch of its AVA product family, an off-the-shelf, modular line-scan detector series engineered to deliver superior imaging performance, versatility, and cost efficiency across security and industrial X-ray ima... Read More

YINCAE Advanced Materials has announced the launch of UF 66L, a next-generation Optical Clear Underfill (OCU) developed for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies where optical clarity, thermal endurance, and long-term reliability... Read More