In-Circuit Testing (ICT) is an automated PCB testing technique used in electronics manufacturing to verify the electrical performance of individual components and interconnections on an assembled printed circuit board. The test is performed using a bed-of-nails fixture, where spring-loaded probes contact designated test points on the PCB to electrically access different nodes of the circuit and measure component behavior directly on the board.
During ICT, automated test systems apply electrical stimuli and measure parameters such as resistance, capacitance, inductance, diode polarity, transistor operation, and voltage levels. These measurements allow the system to validate component values and verify electrical connectivity between nodes. ICT is capable of detecting common assembly defects such as open circuits, shorts, incorrect component values, wrong orientation, missing components, and solder joint failures.
ICT equipment isolates individual components from the rest of the circuit using controlled test signals, allowing accurate testing of each component without powering the entire board. The test program is developed specifically for each PCB design and works together with a custom fixture designed to contact all required test points on the board.
In-Circuit Testing is widely used in high-volume PCB assembly lines to identify manufacturing defects early in the production process before functional testing. ICT improves manufacturing yield and ensures consistent assembly quality in complex electronic systems.
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