X-ray inspection is a non-destructive testing technique used in PCB assembly to evaluate internal solder joints, hidden interconnections, and assembly defects that cannot be detected through visual inspection. It is especially important for inspecting bottom-terminated component packages such as Ball Grid Arrays (BGA), Quad Flat No-Lead (QFN), Chip Scale Packages (CSP), and Land Grid Arrays (LGA) where solder joints are located underneath the package body.
During inspection, the PCB is exposed to controlled X-ray radiation, allowing imaging systems to generate high-resolution images of solder joints and internal structures. This enables engineers to identify defects such as solder voids, insufficient solder, solder bridging, head-in-pillow defects, misalignment, open connections, and short circuits, which can impact the electrical reliability of the assembly.
Modern inspection systems use 2D X-ray imaging and 3D computed tomography (CT) scanning to analyze solder joint geometry, solder ball collapse, and void distribution within solder joints. These systems provide detailed internal views that help engineers verify assembly quality and detect defects in high-density PCB assemblies.
X-ray inspection services are commonly used during prototype validation, manufacturing process development, production quality control, and failure analysis to ensure the reliability and performance of advanced electronic assemblies.
PCB Directory is the largest online directory of PCB Companies. We have listed leading X-Ray Inspection companies worldwide and made them searchable by their location and capabilities.
