Editorial Team - PCB Directory
Aug 22, 2021
A Through-Hole Via is the most common type of via used in PCBs. They are formed by drilling a hole through the Printed Circuit Board from top to bottom connecting all the layers of a Multi-Layer PCB. Through hole Vias can be constructed by using a drill or laser. These are easy to construct and are the most cost-effective type of vias.
Through-Hole Vias do have some disadvantages - because they connect all the layers of a PCB, they take up space on each layer, even if certain layers do not need to be connected to each other, thereby resulting in a waste of space on certain layers. Also when using through-hole Vias, the location of the connection between each layer is fixed which sometimes is not optimal and can result in an inefficient circuit design.
When designing compact PCBs, designers try to make use of every mm of board space, as a result, they use a mix of through-hole vias, buried vias and blind vias.
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