TRI Launches New High-Throughput 3D AXI Inspection System

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Test Research, Inc. (TRI), a provider of test and inspection systems for the electronics manufacturing industry, announced the launch of the TR7600 SV Series. The new line scan 3D AXI system delivers up to a 20% performance improvement compared to the TR7600 SIII series.

Equipped with a high-speed platform, the TR7600 SV Series supports image reconstruction and defect detection for BGAs, THT, SiP, and other applications. The multi-resolution design, ranging from 7 to 25 µm, supports defect detection requirements across a range of applications.

The series includes the TR7600 SV, which supports boards up to 950 x 520 mm, and the TR7600LL SV, which accommodates PCB sizes up to 1000 x 660 mm.

Powered by AI algorithms, the 3D AXI system can detect low-contrast defects. The system includes software and a component library designed to simplify programming and reduce downtime. Additional AI capabilities include the AI Verify Host (Buy Off Station), AI Image Denoising, and AI Fine Tuning, which enable operators to optimize programming, reduce programming time, and fine-tune programs using the expertise of a senior operator.

The TR7600 SV Series connects with MES applications and complies with Industry 4.0 standards, including IPC-CFX-2591, SECS/GEM, SMEMA, and The Hermes Standard (IPC-HERMES-9852).

Click here to learn more about the TR7600 Series.

Click here to learn more about the TRI.