TTM Technologies Opens New PCB Manufacturing Facility in Syracuse to Support Defense Electronics Production

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TTM Technologies, Inc. (“TTM”), a U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (“Ultra-HDI”) printed circuit board (“PCB”) manufacturing facility in Syracuse, New York.

The new facility, spanning 215,000 square feet on TTM's existing Syracuse campus, is among the first in the nation to be purpose-built for Ultra-HDI PCB and advanced packaging production serving aerospace and defense programs. The investment will create up to 400 new engineering and manufacturing jobs, bringing TTM's total Central New York workforce to approximately 1,000 employees.

"This is more than a facility — it is a statement about where American defense manufacturing is headed," said Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies. "Our defense customers need trusted, domestic, ultra-high-density interconnect production capability that meets the most demanding program requirements in the world. Today, we bring that capability to the United States. This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York, and positions TTM to support the next generation of defense and national security technologies for decades to come."

The Syracuse facility addresses a gap in the U.S. defense industrial base. Ultra-HDI PCBs, which enable miniaturization and performance density in advanced electronics, are used in defense platforms including radar systems, missile defense architectures, space-based sensors, and autonomous systems. Domestic production capacity for these board technologies has been limited, with much of the global manufacturing capacity located in Asia.

The project received a $30 million investment from the U.S. Department of War, reflecting the facility's role in domestic microelectronics manufacturing.

First announced in November 2023 and marked with a beam-signing ceremony attended by Governor Kathy Hochul in October 2024, the facility builds on TTM's more than 60-year manufacturing presence in Syracuse and its role as a supplier to the aerospace and defense sector.

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