https://cdn.pcbdirectory.com/news/csm_PCB_DenciTec7low_4f270d3364_638538475575116480.jpg712370
Cicor has introduced its groundbreaking DenciTec® PCBs, pushing the boundaries of high-density circuit manufacturing. Leveraging advanced technologies and innovative base materials, Cicor ensures unparalleled quality and design freedom. This breakthrough promises significant miniaturization, greater functionality, and cost efficiency, positioning DenciTec® as a game-changer in the electronics industry.
Contact Cicor Group to learn more.
Cicor's DenciTec® PCBs are at the forefront of modern electronics, enabling the production of circuits with unprecedented density. The technology allows for line widths and spacings down to 25 µm (1 mil), and copper thicknesses of 20 µm (0.8 mil) +/- 5 µm on all layers, facilitating highly compact and efficient designs.
One of the standout features of DenciTec® is its capability to create laser-via diameters as small as 30 µm (1.4 mil) and annular rings of 30 µm (1.2 mil) for inner layers and 20 µm (0.8 mil) for outer layers. Additionally, the technology supports copper-filled blind vias with options for via stacking and vias-in-pads, further enhancing design flexibility.
The use of a 12.5 µm (0.5 mil) polyimide core material enables the production of ultra-thin circuits, with 4-layer flex circuits measuring less than 120 µm (4.7 mil) in thickness. This level of miniaturization ensures maximum reliability and opens up new possibilities in circuit design.
DenciTec® offers more than just miniaturization. It significantly increases integration capabilities, allowing more space for additional components such as batteries. This higher packing density provides designers with more options and removes limitations on design features, resulting in smarter products with enhanced functionality.
Moreover, DenciTec® PCBs offer a cost-effective alternative to thin-film technology, reducing manufacturing costs without compromising on performance. This makes the technology accessible for a wider range of applications, driving innovation and efficiency across the industry.
Click here to learn more about Cicor.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR