Sherlock-300I Inline

Sherlock-300I Inline

Automated Optical Inspection (AOI) Equipment by Manncorp (2 more products)

Note: Your request will be directed to Manncorp

The Sherlock 300I Inline from Manncorp is an Automated Optical Inspection (AOI) Machine that inspects components and solder joints on SMT, through-hole and mixed-technology boards. It supports PCB sizes from 50 x 50 mm to 330 x 250 mm covering components down to 0201 size (01005 optional). This AOI machine has a 2.2-megapixel color camera with a 2/3" CMOS sensor that can be moved using a bi-axial (X-Y) belt-driven motion control. This camera uses Camera Link for high-speed data transmission and has a telecentric lens. It has a resolution of 20 µm (standard lens) & 14 µm (high-magnification lens) with a depth of field of 10 mm (standard lens) & 6 mm (high-magnification lens) and field of view of 41 mm x 22 mm (standard lens) & 29 mm x 15 mm (high-magnification lens). This AOI machine has a scanning speed of 50 cm2/sec and can be controlled via a Core 4 Xeon computer with 4 GB RAM.

The Sherlock 300I Inline can detect defects including, solder joint defects, presence of solder, insufficient solder, excessive solder, opens, cold solder, solder balling, bridging, poor soldering, lifting, fillet coverage (THT), wetting (THT), partial and full lack of solder (THT), blowholes (THT), component defects, missing or extra components, wrong components, shifting, tombstones, reverse polarity, damaged parts, bent IC leads, pin presence (THT )and bent pins (THT). It requires an AC supply of 100-230 V and is available in a package that measures 620 x 758 x 1294 mm.

Product Specifications

Product Details

  • Part Number
    Sherlock-300I Inline
  • Manufacturer
    Manncorp
  • Description
    AOI Machine for SMT, Through-Hole and Mixed-Technology Boards

General Parameters

  • PCB Size
    50 x 50 to 330 x 250 mm
  • Camera
    2.2 MP
  • Resolution
    14 µm, 20 µm
  • Field of View
    41 x 22, 29 x 15 mm
  • Inspection Speed
    50 cm2/s
  • Defect Analysis
    Solder Joint Defects, Presence Of Solder, Insufficient Solder, Excessive Solder, Cold Solder Joint, Solder Balls, Bridging, Poor Soldering
  • Lighting
    RBG and warm-white illumination in 3-ring arrays
  • Power Supply
    AC100V to 230V single-phase
  • Top Clearance
    30, 25 mm
  • Bottom Clearance
    30 mm
  • Operating System
    Core 4 Xeon with 4 GB RAM, Windows® 7 Professional, 64-bit
  • Net Weight
    153, 175 kg
  • Machine Dimension
    620 x 758 x 1294 mm
  • Humidity
    10 to 35 Degree C/30 - 80% non-condensing RH
  • Air Input
    0.5 Mpa, 5 l/min (ANR)

Technical Documents

View more details on the manufacturer's website

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