A-Tech Circuits

(0 reviews)
  • Type: Manufacturer, Assembly
  • China
  • +86-755-23076783
  • 3rd building, Yanchuan north industrial Park, Songgang Town, Bao’an district, Shenzhen City, China

PCB Fabrication Capabilities

Layers

Up to 40 Layers

Board Thickness

0.007 - 0.196 Inches

Timeline

8 to 15 working Days

Board Dimensions

508 x 610 mm

PCB Configuration

  • Single Sided
  • Double Sided

PCB Board

PCB Type

Material

  • CEM
  • CEM-1
  • CEM-2
  • CEM-3
  • Duroid
  • FR-1
  • FR-2
  • FR-4
  • FR-5
  • Kapton
  • Polyester
  • Polyethylene
  • Polyflon
  • Polyimide
  • PTFE
  • Pyralux
  • Teflon
  • XPC
  • FR-3

Material Brand

  • Arlon
  • Chin-Shi
  • Denka
  • Dupont
  • Isola
  • Iteq
  • Kingboard
  • Laird
  • Matsushita
  • Nanya
  • Nelco
  • Neltec
  • Panasonic
  • Rogers

    Material Brand Series

    • Rogers 4350
    • Rogers 4003
  • Taconic
  • Tuc
  • Ventec
  • Metclad
  • Shengyi
  • Bergquist
  • Grace

Manufacture Type

PCB Assembly Capabilities

BGA Pitch

0.5mm

Stencils

Stencil & Solder Paste Stencil

Time Line General Display

8-15 Days

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Capabilites

Time
2 Layers24 Hours to 4 WD
4 Layers48 Hours to 5 WD
10 Layers3 WD to 8 WD
>16 LayersUp to difficulty
General
Layers1 - 40 Layers
Surface FinishHASL, HAL(Lead free), Immersion Gold/Tin/Silver, Gold Plated, OSP, Gold Finger, Peelable mask
Thickness
Board thickness0.2 - 5.0 mm
Aspect Ratio15:1
Materials
MaterialsCEM1, CEM3, FR-4
Material BrandRogers, Taconic, Arlon
Size
Board Size508 x 610 mm
Plug Hole Diameter0.2 - 0.60 mm
General
Layers1 - 6 Layers
Surface FinishElectroless Ni/Au, Electrolytic soft/hard gold
Materials
MaterialsPolyimide, Rigid FR4, PSA, Metal
Size
Smallest Drill Size0.2 mm
Largest Drill Size6.35 mm
General
Layers2 - 10 Layers
Surface FinishElectroless Ni/Au, Electrolytic soft/hard gold
Materials
MaterialsPolyimide, rigid FR4, PSA, metal
Size
Smallest Drill Size0.2 mm
Largest Drill Size6.35 mm

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