Head Electronic co.,limited

  • Type: Manufacturer
  • China, Guangdong, Shenzhen
  • +86-755-23657801
  • No 2013,Zhijian Time Square,Henggang Town,Longgang District,Shenzhen,China, 518000
Head Electronics Co., Limited (Headpcb) was established in 2001, and is now one of leading quick turn Printed Circuit Board manufacturers. They specialize in 2 Layer to 30 layer high-mix, low volume and quick turn prototype PCBs. Headpcb is capable of producing 4,500 different types of PCBs every month. They can meet a 24-hour delivery deadline for double-sided PCBs, 48-hours for 4 to 6 layers and 72-hours for 8 or more layer Printed Circuit Boards. Located in Shenzhen of Guangdong, near Hongkong, Headpcb partners up with UPS, DHL and world-class forwarders to provide an efficient shipping services. In order to satisfy the growing market demands for middle size to high volume production, they established a 2nd factory in 2015, in the Fujian Province of China. The new factory uses state of the art equi...show more
5.0/5.0
Overall
5.0 / 5.0
5.0 / 5.0
5.0 / 5.0
5.0 / 5.0
Likelihood to Recommend:

PCB Fabrication Capabilities Get PCB Fabrication Quote

Layers

Up to 32 Layers

Board Thickness

0.2-6.0mm

Timeline

1 - 5 days

PCB Assembly Capabilities Get PCB Assembly Quote

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided
  • Double Sided

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

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