PCB direct LAB

(0 reviews)
  • Type: Manufacturer, Design, Assembly
  • Italy, Italy, Bolano
  • +39 01871676915
  • via Feletta , 7, Bolano, 19020, Italy
PCB direct lab supports the Customer from the project phase, contributing, when requested, to the improvement of the project itself through DFM (Design for Manufacturing) analysis, to make each project reliable and optimize the costs of the device. Thanks to our new platform you can simulate, configure, order and control the production of your printed material, both for rapid prototyping (also in 24h) and for the production of large volumes. In addition to the present configurations thanks to the constant technological development, on request we execute the following options for the printed circuit boards: Controlled impedance Electrolytic golding Blind / buried holes Metallographic specimens Filling vias holes Press fit holes Beyond the supply of printed circuits, PCB direct lab offers solutions for the assembly o...show more

PCB Fabrication Capabilities

Layers

1 Layer, 2 Layers, 4 Layers, 6 Layers, 8 Layers, 10 Layers, 12 Layers, 14Layers, 16 Layers ...... 1-30 layers

Board Thickness

2L 8mil , 4L 16mil , 6L 32mil , 8L 48mil , 10L 60mil

Timeline

1 Week

PCB Configuration

Material

Material Brand

Manufacture Type

PCB Assembly Capabilities

Time Line General

5 - 6 Days

Coating

Conformal Coating

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Capabilites

Min.line width
Min.line width3mil
Min.line space
Min.line space3mil
Min.hole size
Min.hole size4mil
Impedance control tolerance
Impedance control tolerance±10%
Surface finish
Hal lead freeHal lead free
Immersion goldImmersion gold
Electrolytic goldElectrolytic gold
Immersion SilverImmersion Silver
Immersion TinImmersion Tin
GraphiteGraphite
Bonding NiAuBonding NiAu
Max. outer copper thickness
Max. outer copper thickness10oz
Press fit tolerance
Press fit tolerance±2mil

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