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AT&S, a developer and manufacturer of advanced printed circuit boards and interconnect technologies for applications across electronics, industrial systems, medical technology, automotive, and communications markets, provides Embedded Component Packaging (ECP®) technology that integrates components directly within printed circuit boards, enabling higher levels of miniaturization while increasing functional density in electronic systems.
ECP® technology creates an additional functional layer inside the circuit board by embedding components within the PCB structure rather than placing them only on the surface. This approach allows more functions to be incorporated into boards of the same size and supports applications across medical technology, consumer electronics, industrial systems, and other electronics sectors.
Embedded Design for Higher Functional Density
AT&S developed ECP® technology through years of miniaturization research and development. By embedding components inside the PCB, the technology utilizes internal board space and enables more compact electronic designs. The embedded structure also helps protect integrated components, supports efficient heat dissipation, and reduces signal path lengths, helping to minimize transmission losses. The technology further enables the development of thinner circuit boards and smaller product form factors.
AT&S' Embedded Component Packaging Technology for PCB Miniaturization
Contact AT&S to learn more.
Laser-Based Manufacturing Process
To integrate components within the PCB, AT&S removes targeted material areas from inner layers using laser technology. Components are placed into these recessed areas, after which electrical connections are created through laser drilling processes. This manufacturing approach supports the production of highly compact circuit boards while maintaining precise component integration within the PCB structure.
Applications Across Electronics Markets
AT&S positions ECP® technology for a range of electronics applications where space constraints and system miniaturization are critical. The technology is used in ultra-thin smartphones and tablets, compact communication modules, electronic access systems, medical implants, data centres, smart factories, and consumer electronics products. ECP® circuit boards can also support compact charger designs and enable efficient power delivery in electronic systems.
By embedding components directly into the PCB structure, AT&S provides a miniaturization technology designed to increase functionality within smaller electronic devices while supporting thermal management, reliability, and compact system design.
Click here to learn more about the Embedded Component Packaging technology.
