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Bold Laser Automation has announced its new LASR2424F Laser Automated Solder Reflow System, engineered for high-precision, automated solder reflow of flat and semi-chambered substrates. Designed and manufactured at the company’s New Hampshire facility, the LASR2424F represents a significant advancement in precision laser processing for high-reliability electronics manufacturing.
Built on Bold’s industrial-hardened LPC architecture, the LASR2424F integrates a 300-watt SPI/Trumpf continuous-wave fiber laser with galvanometer-based beam delivery, providing a tightly focused and highly stable optical process for reflow soldering applications. The system delivers ±0.0015-inch (±0.037 mm) laser centroid accuracy and supports substrate sizes up to 24 x 24 inches (600 x 600 mm).
Engineered for advanced PCB and high-frequency component applications, the LASR2424F features:
The LASR2424F system optimizes the solder reflow of specialized assemblies with repeatable, high-speed reflow of multiple eyelets per second. This system improves overall production throughput with automated verification and mapping, reducing manual alignment steps.
“Our LASR2424F system demonstrates the precision and flexibility achievable when laser-based automation meets intelligent motion and vision control,” said Todd E. Lizotte, CEO and co-founder of Bold Laser Automation. “It’s built for engineers who demand both accuracy and adaptability in high-mix, high-performance electronic assembly environments.”
Bold Laser Automation’s LASR2424F system is available for integration into new or existing manufacturing lines. The platform can be customized for flat-panel, hybrid, and microwave substrate processing, and can be configured with nitrogen or argon purge optics for debris-free operation.
Click here to learn more about BOLD Laser Automation.
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