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PCB Technologies will participate in IMS 2026, taking place in Boston from June 9–12, 2026, and will exhibit at Booth 19096. At the event, the company will present HDI, Rigid/Rigid-Flex, RF/Microwave Boards, Heat Management, Signal Integrity, and Custom Solutions, as well as PCB and PCBA capabilities.
The company will also feature its iNPACK division, which focuses on miniaturization and IC packaging solutions for aerospace, defense, high-frequency telecom, and other applications. According to PCB Technologies, its all-in-one solution combines technological capabilities across three divisions located within the same facility. The company stated that this structure supports fabrication processes with quality oversight and cycle times.
Visitors to IMS 2026 will be able to meet with PCB Technologies representatives to discuss RF and microwave applications and other engineering requirements.
Click here to learn more about the PCB Technologies.
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