Indium Corporation to Showcase Advanced Solder Solutions for Power Electronics at APEC 2025

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Indium Corporation®, one of the leading materials providers in the electronics assembly and solder industries, will feature its lineup of high-reliability products at APEC 2025, which is taking place March 16-20 in Atlanta, Georgia.

With a strong focus on power device packaging, Indium Corporation provides advanced material solutions engineered to enhance energy efficiency, optimize thermal management, and support long-term sustainability in electrification applications. A key part of this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored for next-generation power electronics.

Indium Corporation will showcase the following among its featured products:

• Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bond line thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices.
• Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
• QuickSinter®is a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:
  • InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, and die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.
  • InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, and die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.
  • InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100 mm². Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.

Click here to learn more about Indium Corporation’s solder solutions.

Click here to view APEC 2025 event coverage on PCB Directory.