Indium Corporation to Showcase Innovative Durafuse Solder Solutions at NEPCON Japan 2025

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As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, low temperature, and step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock and thermal cycling performance and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. Durafuse® HT is an innovative Pb-free solution that delivers a high-temperature lead-free (HTLF) paste for discrete power electronics devices.
• Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are equal to or higher than a high-Pb solder.

Click here to learn more about NEPCON Japan at booth E66-22.