MacDermid Alpha Introduces New Solder Paste for Ultra-Fine Feature Printing

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MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies. The formulation is designed to support electrochemical reliability while helping manufacturers reduce warpage-induced assembly defects in high-volume production environments.

As electronics continue to miniaturize, component geometries are shrinking while assembly tolerances become increasingly tight across mobile, wearable, and other miniaturized, high-functioning applications. Manufacturers continue to advance yield and process control as ultra-fine geometries scale into high-volume production. These demands require materials capable of delivering defect mitigation at ultra-fine feature sizes.

Product

ALPHA OM-377

ALPHA® OM-377 is engineered to address these challenges through ultra-fine feature printing down to 008004 component sizes, consistent solder paste transfer efficiency across fine-pitch designs, electrochemical performance to support long-term operational reliability, reduced Head-in-Pillow (HiP) and Non-Wet Open (NWO) defects, and wetting performance on brass and nickel surfaces.

These capabilities enable manufacturers to maintain throughput, improve process control, and scale high-density, low-standoff assemblies using fine-pitch components.

ALPHA® OM-377 is designed to deliver performance across both printing and reflow, supporting assembly outcomes in production environments. The chemistry supports no-clean processing with low post-reflow residue suited for dense designs, while its halogen-free composition aligns with environmental and compliance requirements for high-volume manufacturing.

“Ultra-fine feature designs require consistent printing and reflow performance at production scale,” said Sam Foo, Regional Product Manager, Solder Paste. “ALPHA OM-377 is designed to help manufacturers protect yield, maintain process stability, and support reliable assembly performance in high-density applications.”

As consumer electronics continue to miniaturize while integrating greater functionality, materials capable of supporting scalable ultra-fine feature assembly will remain important to next-generation electronics manufacturing.

Click here to learn more about the MacDermid Alpha.

Click here to learn more about the ALPHA OM-377.