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Summit Interconnect provides rigid-flex and flexible PCB solutions designed for applications that require lightweight, compact, and mechanically resilient electronic assemblies. The company supports designs ranging from simple flex circuits to complex multilayer rigid-flex constructions, combining engineering expertise with advanced materials and manufacturing processes.
The company’s rigid-flex PCBs integrate rigid and flexible layers into a single structure, allowing designers to reduce assembly complexity while improving reliability. By incorporating flexible circuits within rigid stack-ups, Summit supports lighter and smaller electronic assemblies with fewer connectors, reduced mass, and improved resistance to vibration, shock, thermal stress, and repeated mechanical bending. Its experience with multilayer rigid-flex stack-ups, tight registration requirements, and advanced materials is aimed at supporting electrical performance and mechanical reliability.
Summit also manufactures flexible circuit boards for applications requiring thin, lightweight interconnects that conform to complex shapes and restricted spaces. The company’s flex PCB capabilities include single-sided, double-sided, and multilayer constructions. Flexible circuits help reduce hardware requirements, simplify assembly, conserve space, and support compact electronic designs through the use of thin polyimide films and bendable circuit formats.
The company’s rigid-flex and flex manufacturing capabilities include high-layer-count rigid-flex constructions exceeding 20 layers for aerospace, defense, and other high-reliability applications. Summit also offers bookbinder technology that uses staggered flex layers to achieve controlled bend radii while reducing the risk of stress, cracking, or buckling in flex regions.
Additional capabilities include both adhesive and adhesiveless flex constructions to address requirements for thickness, flexibility, durability, and signal integrity. The company also utilizes laser-drilled microvias for fine-pitch rigid-flex applications, supporting high-accuracy interconnections through controlled drilling processes.
Summit integrates stiffeners into rigid-flex designs to reinforce critical areas for durability, flatness, assembly handling, and overall manufacturability. The company also applies advanced materials expertise across polyimides, adhesiveless laminates, and hybrid stack-up configurations intended for demanding operating environments.
Through these manufacturing and engineering capabilities, Summit Interconnect supports the production of rigid-flex and flexible PCB assemblies for applications requiring compact form factors, mechanical durability, and reliable electrical performance.
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