Polymatech Opens New 10,000 Square-Foot PCB Manufacturing Facility in Estonia

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Polymatech Electronics Limited has commissioned a printed circuit board (PCB) manufacturing facility in Estonia, marking a strategic expansion into the European market and a shift from component supplier to product-centric solutions provider, the company said on Monday.

The 10,000-square-foot cleanroom plant is equipped with advanced machinery capable of producing up to 50,000 square metres of multi-layer high-density interconnect (HDI) PCBs annually. The facility will cater to premium mobile phone manufacturers and critical sectors, including defence, aerospace, automotive electronics, semiconductor manufacturing, telecommunications infrastructure, industrial electronics, and security.

“Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,” said CEO Eswara Rao Nandam. “This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.”

The Tamil Nadu-based company's Estonian branch began operations on August 8, following its incorporation on November 18, 2024. The facility adheres to stringent industry standards and positions Polymatech Electronics to foster strategic partnerships across Europe as it transitions from a component manufacturer to a comprehensive product manufacturer.

Director and Head of PCB Business Tarja Rapala said the plant, which began operations on August 8, reflects Polymatech’s dedication to quality, reliability, and customer-centric innovation. “With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe,” she added.

Chief Innovation Officer Allen Nejah called the facility “a remarkable achievement” that enhances the company’s ability to supply sophisticated PCB solutions to Europe’s technology and defence sectors. He said the plant’s portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer designs of up to 48 layers for high-end electronics.

Urmas Aruoja, CEO of the Estonia unit, said the company can deliver PCBs in as little as 24 hours. The product range includes substrate-like PCBs, rigid-flex PCBs, integrated circuit substrates, RF PCBs, and high-density modules. Advanced HDI PCBs incorporate laser microvias, sequential lamination structures, fine lines, and high-performance thin materials, enabling greater functionality per unit area.

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