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Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, has introduced a new size configuration for SPI and AOI Models.
The new Size M configuration for selected Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) platforms provides manufacturers with greater flexibility for large-sized board applications, such as EV batteries, data center boards, and more.
The size M configuration has a board handling capability of up to 660 x 690 mm. The lineup includes the TR7007M SIII and TR7007MD/Q SII for SPI, and the TR7700MQ SII, TR7700M SIII Ultra, TR7500M SIII Ultra, and TR7700MQC SII for AOI.
TRI inspection solutions support current Smart Factory and communication standards such as SMEMA, SECS/GEM, IPC-CFX-2591, and IPC-HERMES-9852, ensuring a cost-effective, Industry 4.0-compliant solution for comprehensive defect detection and data exchange.
Click here for more information about TRI's Inspection solutions.
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